Solid state drive apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorJung-hoon Kim
Life of this patent
Estimating the term…
Abstract
A solid state drive apparatus includes a housing having a first accommodation space and a second accommodation space; a substrate mounted in the first accommodation space, wherein at least one non-volatile memory chip is mounted on the substrate; and a heat dissipation member mounted in the second accommodation space and including an isolation barrier that defines a boundary between the second accommodation space and the first accommodation space and a plurality of fin portions that extend from the isolation barrier away from the first accommodation space, wherein a plurality of through air holes are provided in a side of the housing adjacent the second accommodation space.
Claims18
A solid state drive apparatus comprising:
- a housing comprising an upper housing and a lower housing;
- a heat dissipation member in the housing and comprising an isolation barrier separating first and second accommodation spaces within the housing and a plurality of fin portions that extend from the isolation barrier into the second accommodation space, wherein the isolation barrier thermally contacts and abuts the upper housing and the lower housing;
- a substrate in the first accommodation space;
- a solid-state drive circuit on the substrate;
- and
- a connector mechanically attached at an edge of the substrate, electrically coupled to the solid-state drive circuit and externally accessible at a side of the housing,
- where the housing has a plurality of holes therein supporting air flow through the second accommodation space.
A solid state drive apparatus comprising:
- a substrate;
- a plurality of semiconductor chips including a controller chip and at least one non-volatile memory chip on the substrate;
- a heat dissipation member comprising an isolation barrier, the isolation barrier isolation barrier thermally contacts and abuts an upper portion of the housing and a lower portion of the housing, the isolation barrier facing a first end of the substrate and a plurality of fin portions extending from the isolation barrier in a direction away from the substrate;
- the housing enclosing the substrate and the heat dissipation member;
- and
- a connector attached at a second end of the substrate, electrically coupled to the plurality of semiconductor chips and externally accessible at a side of the housing.
A solid state drive apparatus, comprising:
- a housing including a first compartment, a second compartment, an upper housing and a lower housing;
- a printed circuit board in the first compartment;
- a solid-state drive circuit on the printed circuit board;
- a connector attached to the printed circuit board and externally accessible at a side of the housing, an isolation barrier between the first compartment and the second compartment thermally contacting and abutting the upper housing and the lower housing, wherein the isolation barrier blocks aft flow between the first compartment and the second compartment;
- a heat dissipation member comprising a plurality of fins in the second compartment and thermally coupled through the isolation barrier to the printed circuit board in the first compartment;
- and a plurality of through air holes in a side of the housing adjacent the second compartment, the plurality of through air holes permitting airflow through the second compartment.
Dependencies are inferred from the claim text.