Manufacturing apparatus of semiconductor device and management method of manufacturing apparatus of semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorEishi Shiobara
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Abstract
According to one embodiment, a management method of a manufacturing apparatus of a semiconductor device, the method includes measuring a weight of a pre-exposure substrate including a semiconductor substrate and a resist film provided on the semiconductor substrate, performing an exposure process for the resist film, measuring a weight of a post-exposure substrate including the semiconductor substrate and the resist film after the exposure process is performed, and acquiring a weight difference between the weight of the pre-exposure substrate and the weight of the post-exposure substrate.
Claims8
A management method of a manufacturing apparatus of a semiconductor device, the method comprising:
- measuring a weight of a pre-exposure substrate including a semiconductor substrate and a resist film provided on the semiconductor substrate;
- performing an exposure process for the resist film;
- measuring a weight of a post-exposure substrate including the semiconductor substrate and the resist film after the exposure process is performed;
- acquiring a weight difference between the weight of the pre-exposure substrate and the weight of the post-exposure substrate;
- and
- acquiring a film thickness of a contamination film produced by the exposure process based on the weight difference.
Dependencies are inferred from the claim text.