Structured substrate for optical fiber alignment
AssigneeInternational Business Machines Corporation
InventorsRussell A. Budd, Paul F. Fortier
Life of this patent
Estimating the term…
Abstract
A structured substrate for optical fiber alignment is produced at least in part by forming a substrate with a plurality of buried conductive features and a plurality of top level conductive features. At least one of the plurality of top level conductive features defines a bond pad. A groove is then patterned in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop. At least a portion of an optical fiber is placed into the groove.
Claims1
An apparatus formed at least in part by the steps of:
- forming a substrate comprising a plurality of buried conductive features and a plurality of top level conductive features, at least one of the plurality of top level conductive features defining a bond pad;
- patterning a groove in the substrate utilizing a portion of the plurality of top level conductive features as an etch mask and one of the plurality of buried conductive features as an etch stop;
- and
- placing at least a portion of an optical fiber into the groove to form an arrangement wherein at least a portion of the optical fiber sits in the groove adjacent to the portion of the plurality of the top level conductive features used as an etch mask, and rests on the one of the plurality of buried conductive features used as an etch stop.
Dependencies are inferred from the claim text.