Vacuum socket and semiconductor testing system including the same

A semiconductor testing system, comprising:

• a loading part configured to convey first semiconductor chips;
• a testing part including a contact tool configured to perform test and pick-up operations on the first semiconductor chips;
• and
• an unloading part configured to unload the first semiconductor chips from the testing part,
• wherein the contact tool has a plurality of vacuum sockets, and
• each of the vacuum sockets comprises:
• a lower housing including a concave portion with a lower hole, the concave portion having a recessed cross section;
• a printed circuit board positioned in the concave portion, the printed circuit board having a penetration hole coupled to the lower hole;
• a vacuum pad inserted in the lower hole coupled to the penetration hole;
• and
• an upper housing on the lower housing, the upper housing having an upper hole overlapped with the lower hole, when viewed in plan view,
• wherein the printed circuit board comprises at least one conduit, which is configured to allow air to flow from the penetration hole and the vacuum pad toward the upper hole and is used as an air flow pathway.

A vacuum socket, comprising:

• a printed circuit board configured to load a semiconductor chip on a top surface thereof and having a penetration hole;
• a cover on the semiconductor chip;
• a lower housing covering side surfaces of the printed circuit board, the semiconductor chip and the cover, and a bottom surface of the printed circuit board, the lower housing having a lower hole coupled to and overlapped with the penetration hole, when viewed in plan view;
• and
• a vacuum pad inserted in the lower hole,
• wherein the printed circuit board has at least one conduit formed on a top surface thereof, the conduit being connected to the penetration hole and being used as an air flow pathway, allowing air to be pumped out to a region external the printed circuit board.