MEMS inertial sensor and forming method therefor
AssigneeMemsen Electronics Inc
InventorLianjun Liu
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Abstract
A MEMS inertial sensor, may include a movable sensitive element; and second substrate and a third substrate. The movable sensitive element may be formed by using a first substrate which may be formed of a monocrystalline semiconductor material. The first substrate may include a first surface and a second surface which are opposite to each other. One or more conductive layers may be formed on the first surface of the first substrate The second substrate may be coupled to a surface of the one or more conductive layer on the first substrate. The third substrate may be coupled to the second surface of the first substrate. The third substrate and the second substrate are respectively arranged on two opposite sides of the movable sensitive element.
Claims18
An MEMS inertial sensor, comprising:
- a movable sensitive element;
- and
- a second substrate and a third substrate;
- wherein the movable sensitive element is formed by using a first substrate which is formed of a monocrystalline semiconductor material, the first substrate comprises a first surface and a second surface which are opposite to each other, one or more deposited conductive layers are formed on the first surface of the first substrate, wherein the one or more deposited conductive layers comprise a first electrical shielding layer of the MEMS inertial sensor and the first electrical shielding layer is electrically connected to the first substrate through one or more vias with the one or more vias only between the first electrical shielding layer and the first substrate;
- and
- wherein the second substrate is bonded to a surface of the one or more deposited conductive layers on the first substrate directly or indirectly through a coupling layer, the third substrate is bonded to the second surface of the first substrate directly or indirectly through a coupling layer to seal the MEMS inertial sensor, and the third substrate and the second substrate are respectively arranged on two opposite sides of the movable sensitive element.
A method for forming an MEMS inertial sensor, comprising:
- providing a first substrate, wherein the first substrate is a monocrystalline semiconductor substrate, and the first substrate has a first surface and a second surface opposite to the first surface;
- depositing one or more conductive layers on the first surface of the first substrate, wherein the one or more conductive layers comprise a first electrical shielding layer of the MEMS inertial sensor;
- depositing one or more insulating layers between the first electrical shielding layer and the first substrate;
- forming one or more vias between the first electrical shielding layer and the first substrate, to electrically connect the first electrical shielding layer to the first substrate;
- providing a second substrate;
- bonding the second substrate to a surface of the one or more conductive layers on the first substrate directly or indirectly through a coupling layer, after the first electrical shielding layer is connected to the first substrate through the one or more vias;
- forming a movable sensitive element by using the first substrate from the side of the second surface of the first substrate;
- providing a third substrate;
- and
- bonding the third substrate to the second surface of the first substrate directly or indirectly through a coupling layer to seal the MEMS inertial sensor, wherein the third substrate and the second substrate are respectively arranged on two opposite sides of the movable sensitive element.
Dependencies are inferred from the claim text.