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US 9,958,351 B2Granted
Strain compensation for pressure sensors
AssigneeMedtronic, Inc.
InventorsJonathan L. Kuhn, Richard J. O'Brien, Jonathan P. Roberts, James D. Reinke, Michael B. Terry, Kamal Deep Mothilal
Life of this patent
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Abstract
A pressure sensing system provides signals representative of a magnitude of pressure at a selected site. A sensor module includes a first transducer producing a first signal having an associated first response to pressure and strain applied to the sensor module and a second transducer producing a second signal having an associated second response to pressure and strain applied to the sensor module. A calculated pressure, a bending pressure error and a bend-compensated pressure are computed in response to the first signal and the second signal.
Claims31
A pressure sensing system for providing signals representative of a magnitude of pressure at a selected site, comprising:
- a sensor module at least one of on or enclosed within a sensor housing module configured for implantation within a patient, the sensor module comprising:
- a first transducer configured to produce a first signal having an associated first response to pressure and a bending moment applied to the sensor module;
- and
- a second transducer configured to produce a second signal having an associated second response to pressure and the bending moment applied to the sensor module, wherein the second response is different than the first response,
- wherein the first transducer and the second transducer are coupled to a substrate, the first transducer located in a peripheral region of the substrate relative to the second transducer;
- and
- a processor configured to:
- receive the first signal and the second signal, and
- determine a calculated pressure based on the first signal, wherein the calculated pressure includes a bending pressure error due to bending of the sensor module,
- determine the bending pressure error based on the first signal and the second signal, and
- determine a bend-compensated pressure in response to receiving the first signal and the second signal based on the bending pressure error.
8 more elements
A pressure sensing system for providing signals representative of a magnitude of pressure at a selected site, comprising:
- a sensor module comprising:
- a first transducer configured to produce a first signal having an associated first response to pressure and a bending moment applied to the sensor module;
- and
- a second transducer configured to produce a second signal having an associated second response to pressure and the bending moment applied to the sensor module, wherein the second response is different than the first response,
- wherein the second transducer comprises:
- a first component, wherein the first component is configured to produce a first output having a first response to bending and temperature applied to the module;
- and
- a second component, wherein the second component is configured to produce a second output having a second response to bending and temperature applied to the module, wherein the second response is different than the first response, and
- wherein the sensor module further comprises:
- a substrate;
- and
- a hybrid circuit mounted on the substrate, wherein the first transducer comprises a first air gap capacitor, wherein the first component comprises a second air gap capacitor, and wherein the second component comprises a capacitor incorporated in the hybrid circuit;
- and
- a processor configured to:
- receive the first signal and the second signal, wherein the processor is configured to receive the second signal from at least one of the first output and the second output, and wherein the processor is configured to determine the bending pressure error based on the first signal and the second signal, and
- determine a calculated pressure, a bending pressure error, and a bend-compensated pressure in response to receiving the first signal and the second signal.
13 more elements
A method for providing signals representative of a magnitude of pressure at a selected site, the method comprising:
- detecting a first signal produced by a first transducer, the first signal having an associated first response to pressure and a bending moment applied to a sensor module comprising the first transducer and a second transducer, the sensor module at least one of on or enclosed within a sensor housing module configured for implantation within a patient,
- detecting a second signal produced by the second transducer, the second signal having an associated second response to pressure and the bending moment applied to the sensor module, the first transducer and the second transducer coupled to a substrate, the first transducer located in a peripheral region of the substrate relative to the second transducer;
- and
- determining a calculated pressure comprising determining the calculated pressure based on the first signal, wherein the calculated pressure includes a bending pressure error due to bending of the sensor module,
- determining a bending pressure error based on the first signal and the second signal, and determining a bend-compensated pressure in response to detecting the first signal and the second signal based on the bending pressure error.
2 more elements
An implantable pressure sensing system for providing signals representative of a magnitude of a cardiovascular pressure of a patient at a selected site, comprising:
- a sensor housing module configured for implantation within the patient;
- a sensor module at least one of on or enclosed within the sensor housing module, the sensor module comprising:
- a first transducer configured to produce a first signal having an associated first response to pressure and a bending moment applied to the sensor module;
- and
- a second transducer configured to produce a second signal having an associated second response to pressure and the bending moment applied to the sensor module, wherein the second response is different than the first response,
- the first transducer and the second transducer each comprising a capacitive plate coupled to a top side of a substrate and forming air gap capacitors, the air gap capacitor of the first transducer located in a peripheral region of the substrate relative to the air gap capacitor of the second transducer,
- the second transducer further comprising an on-chip capacitor incorporated into a hybrid circuit mounted on the substrate;
- and
- a processor configured to:
- receive the first signal and the second signal, and
- determine a calculated pressure based on the first signal, wherein the calculated pressure includes a bending pressure error due to bending of the sensor module,
- determine the bending pressure error based on the first signal and the second signal, and
- determine a bend-compensated pressure in response to receiving the first signal and the second signal based on the bending pressure error.
10 more elements
Dependencies are inferred from the claim text.