Capacitive sensor, acoustic sensor and microphone
AssigneeOMRON Corporation
InventorTadashi Inoue
Life of this patent
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AssigneeOMRON Corporation
InventorTadashi Inoue
Estimating the term…
A chamber that penetrates vertically is formed in a silicon substrate. A diaphragm is arranged on the upper surface of the silicon substrate so as to cover the upper opening of the chamber. Leg pieces are provided in corner portions of the diaphragm, within the diaphragm. The diaphragm and the leg pieces are separated by slits, and the leg pieces extend in the diagonal directions of the diaphragm. The leg pieces are connected to the diaphragm at the ends on the outer peripheral side of the diaphragm, and the ends on the central side of the diaphragm are supported by anchors provided on the upper surface of the silicon substrate. A back plate is provided above the silicon substrate so as to cover the diaphragm, and a fixed electrode plate is provided on the lower surface of the back plate so as to oppose the diaphragm.
A capacitive sensor comprising:
A capacitive sensor comprising:
Dependencies are inferred from the claim text.