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US 9,958,261 B2Granted
Device and method for surface profilometry for the control of wafers during processing
AssigneeUnity Semiconductor Corporation
InventorGilles Fresquet
Life of this patent
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AssigneeUnity Semiconductor Corporation
InventorGilles Fresquet
Estimating the term…
A device or apparatus is provided for carrying out measurements of shape on a first surface of a wafer relative to structures present beneath the first surface including (i) profilometry apparatus arranged in order to carry out measurements of shape on the first surface of the wafer according to at least one measurement field; (ii) imaging apparatus facing the profilometry apparatus and arranged in order to acquire a reference image of the structures on or through a second surface of the wafer opposite to the first surface according to at least one imaging field; the profilometry apparatus and said imaging apparatus being arranged so that the measurement and imaging fields are referenced in position within a common frame of reference. A method is also provided to be implemented in this device or this apparatus.
A device for carrying out measurements of shape on a first surface of a wafer relative to structures present beneath said first surface, comprising:
A method for carrying out measurements of shape on a first surface of a wafer relative to structures present beneath said first surface, comprising the following steps:
Dependencies are inferred from the claim text.