Metal plating method and apparatus

An electroplating apparatus for use in plating a desired surface area of a conductive component adapted to be charged as a cathode during a plating process, the apparatus comprising an injection head sized and shaped to circumscribe the desired surface area to be plated and isolate the desired surface area from the remainder of the conductive component, the injection head having a non-conductive end having a geometry tailored to a geometry of the conductive component and configured to provide a male-female fitting engagement between the injection head and the conductive component, the geometry of the non-conductive end being configured to align the injection head in a predetermined position relative to the conductive component, the injection head and the desired surface area defining a localized plating chamber therebetween, an anode provided on the injection head and disposed to face the surface area to be plated when the injection head is positioned on the conductive component, a supply passage defined in said injection head and extending through a wall of the injection head between an inlet port connectable to a source of plating solution and a plurality of circumferentially distributed discharge holes for allowing a plating solution to be supplied into said localized plating chamber, and an electric contact for connecting the anode to a power supply.