Film formation device and film formation method for forming metal film
AssigneeToyota Jidosha Kabushiki Kaisha
InventorsMotoki Hiraoka, Hiroshi Yanagimoto, Yuki Sato, Takayasu Yoshioka
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AssigneeToyota Jidosha Kabushiki Kaisha
InventorsMotoki Hiraoka, Hiroshi Yanagimoto, Yuki Sato, Takayasu Yoshioka
Estimating the term…
Provided are a film formation device and a film formation method for forming a metal film, with which metal films with a desired thickness can be continuously formed on surfaces of a plurality of substrates. A film formation device 1A includes at least a positive electrode 11, a negative electrode 12, a solid electrolyte membrane 13 arranged on a surface of the positive electrode 12, between. the positive electrode and a substrate to serve as the negative electrode, and a power supply unit E adapted to apply a voltage across the positive electrode 11 and the substrate B. A voltage is applied across the positive electrode 11 and the substrate B to deposit metal on a surface of the substrate from metal ions contained in the solid electrolyte membrane 13, whereby a metal film F made of metal is formed, The positive electrode 11 is made of a porous body that allows a solution L containing metal ions to pass therethrough and supplies the metal ions to the solid electrolyte membrane 13.
A film formation device for forming a metal film, comprising at least:
A film formation device for forming a metal film, comprising at least:
A film formation device for forming a metal film, comprising at least:
Dependencies are inferred from the claim text.