Pattern transfer mold and pattern formation method

A pattern formation method, comprising:

• first supply processing including causing first and second stacked bodies of a pattern transfer mold to oppose a front surface of a patterning body and supplying a voltage between the patterning body and at least one of a plurality of first conductive layers and between the patterning body and at least one of a plurality of second conductive layers;
• and
• first removal processing including removing at least a portion of one selected from a first patterning unit of the patterning body and a second patterning unit of the patterning body, the first patterning unit including a first portion of the patterning body and a second portion of the patterning body, the first portion opposing the at least one of the first conductive layers, the second portion opposing the at least one of the second conductive layers, the second patterning unit including a third portion of the patterning body and a fourth portion of the patterning body, the third portion opposing the first insulating layer, the fourth portion opposing the second insulating layer,
• the pattern transfer mold including:
• a base body including
• a base unit having a first surface,
• a first protrusion provided on the first surface, the first protrusion having a first side surface intersecting the first surface, and
• a second protrusion provided on the first surface and separated from the first protrusion in a first direction parallel to the first surface, the second protrusion having a second side surface intersecting the first surface and opposing the first side surface in the first direction;
• a first stacked body provided on the first side surface between the first protrusion and the second protrusion, the first stacked body including a plurality of first conductive layers and a first insulating layer, the first conductive layers being arranged in the first direction, the first insulating layer being provided between the first conductive layers;
• a second stacked body provided on the second side surface between the first protrusion and the second protrusion and separated from the first stacked body, the second stacked body including a plurality of second conductive layers and a second insulating layer, the second conductive layers being arranged in the first direction, the second insulating layer being provided between the second conductive layers, the second stacked body being capable of containing, between the first stacked body and the second stacked body, a gas or a material having a hardness lower than hardnesses of the first protrusion, the second protrusion, the first stacked body, and the second stacked body;
• a first electrode electrically connected to at least one of the first conductive layers;
• and
• a second electrode electrically connected to at least one of the second conductive layers;
• wherein a pitch of the plurality of first conductive layers is less than the length in the first direction of the first protrusion, and a pitch of the plurality of second conductive layers is less than the length in the first direction of the second protrusion.