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US 9,957,589 B2Granted
Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector material
AssigneesMitsubishi Shindoh Co., Ltd., Mitsubishi Materials Corporation
InventorsKeiichiro Oishi, Takashi Hokazono, Michio Takasaki, Yosuke Nakasato
Life of this patent
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Abstract
The present invention relates to a copper alloy sheet for terminal and connector materials, which is excellent in terms of tensile strength, proof stress, Young's modulus, electric conductivity, bending workability, stress corrosion crack resistance, stress relaxation characteristics and solderability.
Claims6
A copper alloy sheet for terminal and connector materials comprising:
- 4.5 mass % to 12.0 mass % of Zn;
- 0.40 mass % to 0.9 mass % of Sn;
- 0.01 mass % to 0.08 mass % of P;
- 0.52 mass % to 0.85 mass % of Ni;
- and
- any one or both of 0.005 mass % to 0.08 mass % of Co and 0.004 mass % to 0.03 mass % of Fe,
- with a remainder being Cu and inevitable impurities,
- wherein a content of Zn [Zn] (mass %), a content of Sn [Sn] (mass %), a content of P [P] (mass %), a content of Co [Co] (mass %) and a content of Ni [Ni] (mass %) have a relationship of 17≤[Zn]+7.5×[Sn]+16×[P]+10×[Co]+3.5×[Ni]≤19 and have a relationship of 7≤[Ni]/[P]≤40 and 0.6≤[Ni]/[Sn]≤1.9,
- Zn and Sn form solid solution in a matrix,
- an average crystal grain diameter is in a range of 2.0 μm to 8.0 μm,
- an average particle diameter of circular or elliptical precipitates containing Ni—P compound is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more,
- an electric conductivity is 29% IACS or more,
- a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance,
- bending workability is R/t≤0.5 at W bending,
- solderability is excellent,
- stress corrosion crack resistance is excellent,
- a Young's modulus is 100×103 N/mm2 or more, and
- a 0.2% proof stress is greater than or equal to 480 N/mm2 and less than or equal to 607 N/mm2.
15 more elements
A copper alloy sheet for terminal and connector materials comprising:
- 8.5 mass % to 12.0 mass % of Zn;
- 0.40 mass % to 0.9 mass % of Sn;
- 0.01 mass % to 0.08 mass % of P;
- 0.40 mass % to 0.85 mass % of Ni;
- and
- any one or both of 0.005 mass % to 0.08 mass % of Co and 0.004 mass % to 0.03 mass % of Fe,
- with a remainder being Cu and inevitable impurities,
- wherein a content of Zn [Zn] (mass %), a content of Sn [Sn] (mass %), a content of P [P] (mass %), a content of Co [Co] (mass %) and a content of Ni [Ni] (mass %) have a relationship of 17≤[Zn]+7.5×[Sn]+16×[P]+10×[Co]+3.5×[Ni]≤19 and have a relationship of 7≤[Ni]/[P]≤40 and 0.55≤[Ni]/[Sn]≤1.9,
- Zn and Sn form solid solution in a matrix,
- an average crystal grain diameter is in a range of 2.0 μm to 8.0 μm,
- an average particle diameter of circular or elliptical precipitates containing Ni—P compound is in a range of 4.0 nm to 25.0 nm or a proportion of the number of precipitates having a particle diameter in a range of 4.0 nm to 25.0 nm in the precipitates is 70% or more,
- an electric conductivity is 29% IACS or more,
- a percentage of stress relaxation is 30% or less at 150° C. for 1000 hours as stress relaxation resistance,
- bending workability is R/t≤0.5 at W bending,
- solderability is excellent,
- stress corrosion crack resistance is excellent,
- a Young's modulus is 100×103 N/mm2 or more, and
- a 0.2% proof stress is greater than or equal to 480 N/mm2 and less than or equal to 607 N/mm2.
15 more elements
Dependencies are inferred from the claim text.