Photocurable adhesive film for organic electronic device seal, organic electronic device and method for sealing same

An organic electronic device, comprising:

• a substrate;
• an organic light-emitting element formed on a portion of the substrate;
• and
• a heat-cured product of a curable pressure-sensitive adhesive film encapsulating:
• an entire surface of the organic light-emitting element, and
• an area of the substrate where the organic light-emitting element is not formed,
• wherein the curable pressure-sensitive adhesive film comprises a curable pressure-sensitive adhesive layer comprising a photocurable pressure-sensitive adhesive composition comprising an acrylic polymer, an epoxy resin, a crosslinking agent and a photoinitiator,
• wherein the heat-cured product of the curable pressure-sensitive adhesive film has a photocured part only on the area that covers the substrate where the organic light-emitting element is not formed,
• wherein a difference in gel content between the photocured part and a part that covers the organic light-emitting element of the heat-cured product of the curable pressure-sensitive adhesive film is 10% or more, and
• wherein the heat-cured product of the curable pressure-sensitive adhesive film is formed by photocuring the area of the curable pressure-sensitive adhesive layer that covers the substrate where the organic light-emitting element is not formed, and then, heat-curing the curable pressure-sensitive adhesive layer at a temperature in a range of 30 to 80° C. after phtocuring.