Adhesive composition for semiconductor and adhesive film including the same
AssigneeCheil Industries Inc.
InventorsJun Woo Lee, Sung Min Kim, In Hwan Kim, Baek Soung Park, Su Mi Lim, Jae Won Choi
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AssigneeCheil Industries Inc.
InventorsJun Woo Lee, Sung Min Kim, In Hwan Kim, Baek Soung Park, Su Mi Lim, Jae Won Choi
Estimating the term…
An adhesive composition for semiconductors, an adhesive film, and a semiconductor device, wherein, in a curing process including a first stage at a temperature ranging from 120° C. to 130° C. for 1 to 20 minutes, a second stage at a temperature ranging from 140° C. to 150° C. for 1 to 10 minutes, a third stage at a temperature ranging from 160° C. to 180° C. for 30 seconds to 10 minutes, and a fourth stage at a temperature ranging from 160° C. to 180° C. for 10 minutes to 2 hours, the adhesive film has a DSC curing rate in the first stage that is 40% or less of a total curing rate, a DSC curing rate in the fourth stage that is 30% to 60% higher than a DSC curing rate in the third stage, and DSC curing rates in each of the second and third stages that are 5% or more higher than a DSC curing rate of a preceding stage thereof.
An adhesive film for semiconductors, the adhesive film consisting of, based on 100 parts by weight of the adhesive film in terms of solid content:
Dependencies are inferred from the claim text.