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US 9,957,412 B2Granted
Aqueous conductive coating
AssigneeLord Corporation
InventorsTimothy D. Fornes, Richard E. Heinze
Life of this patent
Estimating the term…
Abstract
An aqueous composition is provided comprising a resin, a curative, a filler, a surfactant, and water; wherein the resin comprises an average molecular weight of less than about 800 Daltons and comprises at least 50 weight percent of at least one of: (a) an unmodified epoxy or phenoxy resin, or (b) a surfactant-modified epoxy or phenoxy resin. This composition, applied to a substrate and dried, can then be cured so as to thermoset the resin and self-assemble to form continuous pathways of filler within the resin matrix.
Claims17
An aqueous composition comprising a resin, a curative, a filler, a surfactant, and water;
- wherein the resin comprises an average molecular weight of less than about 800 Daltons and comprises at least 50 weight percent of a surfactant-modified epoxy or phenoxy resin, wherein the surfactant modified epoxy resin comprises at least one of a Bis-A or Bis-F type epoxy resin modified with an ethylene oxide/propylene oxide polyether monoamine.
Dependencies are inferred from the claim text.