Underfill material and method for manufacturing semiconductor device using the same

An underfill material to be pre-applied to a semiconductor chip having a solder-tipped electrode formed thereon before the semiconductor chip is mounted on an electronic component having a counter electrode facing the solder-tipped electrode, the underfill material containing a phenoxy resin, a dicyclopentadiene epoxy resin, an acid anhydride curing agent, an imidazole, a bifunctional (meth)acrylate having a cyclodecane skeleton, an organic peroxide, and a silica blend, the underfill material being in the form of a film, wherein

• a ratio of a total mass of the dicyclopentadiene epoxy resin and the acid anhydride curing agent to a total mass of the bifunctional (meth)acrylate and organic peroxide is in a range of 7:3 to 4:6,
• a minimum melt viscosity attainment temperature and a minimum melt viscosity obtained when melt viscosity of the underfill material is measured at all temperature increase rate conditions within the range of 5 to 50° C./min are in a range of 100 to 150° C. and in a range of 100 to 5000 Pa·s, respectively, and
• a minimum melt viscosity attainment temperature and a minimum melt viscosity obtained when melt viscosity of the underfill material is measured under a temperature increase rate condition of 10° C./min are in a range of 100 to 110° C. and in a range of 100 to 5000 Pa·s, respectively.