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US 9,957,158 B2Granted
Micromechanical pressure sensor
AssigneeRobert Bosch GmbH
InventorsFlorian Grabmaier, Eckart Schellkes, Timo Lindemann
Life of this patent
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Abstract
A method for producing a pressure sensor comprises providing a substrate with a depression; attaching a micromechanical sensor element to the substrate in the depression; attaching an evaluation circuit to the substrate next to the depression; electrically connecting the evaluation circuit to the sensor element; covering the substrate around the depression by means of a potting die such that the depression is closed; potting the evaluation circuit between the substrate and the potting die; and removing the potting die.
Claims1
A method for producing a pressure sensor, comprising:
- providing a substrate with a depression;
- attaching a micromechanical sensor element to the substrate in the depression;
- attaching to the substrate an evaluation circuit next to the depression;
- electrically connecting the evaluation circuit to the sensor element;
- covering the substrate around the depression using a potting die such that the depression is closed, the potting die having a sealing surface, the sealing surface directly contacting the substrate in a manner so as to completely encircle the depression;
- potting the evaluation circuit between the substrate and the potting die using a potting compound, the sealing surface of the potting die sealing the depression from the potting compound without use of any further sealing element between the potting die and the substrate;
- and
- removing the potting die.
5 more elements
Dependencies are inferred from the claim text.