Bond rings in semiconductor devices and methods of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Ming Chen, Ping-Yin Liu, Chung-Yi Yu, Yeur-Luen Tu
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Abstract
An embodiment method includes forming a first plurality of bond pads on a device substrate, depositing a spacer layer over and extending along sidewalls of the first plurality of bond pads, and etching the spacer layer to remove lateral portions of the spacer layer and form spacers on sidewalls of the first plurality of bond pads. The method further includes bonding a cap substrate including a second plurality of bond pads to the device substrate by bonding the first plurality of bond pads to the second plurality of bond pads.
Claims20
A method comprising:
- forming a first plurality of bond pads on a device substrate, wherein top surfaces of the first plurality of bond pads are above a topmost surface of the device substrate;
- depositing a spacer layer over and extending along sidewalls of the first plurality of bond pads;
- etching the spacer layer to remove lateral portions of the spacer layer and form spacers on sidewalls of the first plurality of bond pads, wherein etching the spacer layer further comprises etching back tops of the spacers below the top surfaces of the first plurality of bond pads, and wherein, after the etching back, the tops of the spacers are above the topmost surface of the device substrate;
- and
- bonding a cap substrate comprising a second plurality of bond pads to the device substrate by bonding the first plurality of bond pads to the second plurality of bond pads.
A method comprising:
- bonding a device substrate to a carrier substrate;
- patterning a surface of the device substrate opposing the carrier substrate to form a contact area;
- forming a first bond ring on the contact area;
- depositing a spacer layer over and along sidewalls of the first bond ring;
- patterning the spacer layer to define spacers on sidewalls of the first bond ring, wherein patterning the spacer layer further comprises recessing tops of the spacers below a top surface of the first bond ring, wherein the spacers extend above a topmost surface of the device substrate after the recessing, and wherein the topmost surface of the device substrate is a farthest surface of the device substrate away from the carrier substrate;
- patterning the device substrate to define a micro-electromechanical systems (MEMS) structure;
- and
- eutectically bonding the first bond ring to a second bond ring on a cap substrate, wherein bonding the first bond ring to the second bond ring defines a sealed cavity having the MEMS structure disposed therein.
A package comprising:
- a device substrate comprising a micro-electromechanical systems (MEMS) structure, wherein the device substrate comprises a contact area;
- a first bond ring on the device substrate, wherein the first bond ring is disposed on the contact area, and wherein each of sidewalls of the first bond ring are aligned with a respective one of sidewalls of the contact area;
- spacers disposed on the sidewalls of the first bond ring and on the sidewalls of the contact area;
- and
- a cap substrate bonded to the device substrate, wherein the cap substrate comprises a second bond ring bonded to the first bond ring, and wherein the first bond ring and the second bond ring defines a sealed cavity comprising the MEMS structure.
Dependencies are inferred from the claim text.