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US 9,956,780 B2Granted
Electronic device, liquid ejecting head, and manufacturing method of electronic device
AssigneeSeiko Epson Corporation
InventorsToshinari Nanba, Tomoyoshi Saito, Shuichi Tanaka
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Abstract
An electronic device includes a first substrate including a structure body protruded from one surface; and a second substrate stacked and disposed facing the one surface through a spacer, in which the first substrate and the spacer are bonded to each other by an adhesive, and in which the adhesive is extended up to the structure body along the one surface.
Claims10
An electronic device comprising:
- a first substrate including a structure body protruded from one surface;
- and
- a second substrate stacked and disposed facing the one surface through a spacer, wherein the structure body protrudes towards a surface of the second substrate that includes the spacer,
- wherein the first substrate and the spacer are bonded to each other by an adhesive, and
- wherein the adhesive is extended up to the structure body along the one surface.
2 more elements
Dependencies are inferred from the claim text.