Decorated rigid panel

A method of forming a decorated compression molded component, the method comprising:

• forming a substrate of uncured thermoset material;
• folding the substrate over itself several times to define a multi-layer charge of the uncured thermoset material;
• inserting the multi-layer charge between an upper tool and a lower tool;
• pressing the multi-layer charge by the upper tool and the lower tool while heating the multi-layer charge by the upper and lower tools to shape and cure the multi-layer charge into a rigid, cured compression molded component having a length and width greater than a length and width of the charge;
• separating the upper tool from the cured component and placing a carrier with a transfer image between the compression molded component and the separated upper tool, the transfer image being formed of a sublimation ink;
• and
• transferring at least a portion of the sublimation ink to the compression molded component by pressing the carrier against the compression molded component by the upper and lower tools at a pressure above approximately 100 psi while applying heat, by the upper and lower tools and by heat from the cured compression molded component, to the sublimation ink to between approximately 300 degrees Fahrenheit and approximately 360 degrees Fahrenheit so as to cause the sublimation ink to sublimate and become absorbed into the compression molded component, thereby forming a transferred image therein,
• wherein during said transferring of at least a portion of the sublimation ink to the compression molded component, the upper tool is heated to a temperature that is higher than a temperature to which the lower tool is heated.