Polishing pad and polishing method
AssigneesKyushu University, National University Corporation, Fujibo Holdings, Inc.
InventorsToshiro Doi, Kiyoshi Seshimo, Masataka Takagi, Hiroshi Kashiwada
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Abstract
The present invention provides a polishing pad including a polishing member having a polishing surface, wherein the polishing member contains a material having dilatancy characteristics.
Claims20
A polishing pad comprising a polishing member having a polishing surface, wherein the polishing member comprises a material having dilatancy characteristics, the material forming the polishing surface.
A polishing method comprising a step of polishing an object to be polished using a polishing surface of a polishing pad of a polishing pad, wherein the polishing member comprises a material having dilatancy characteristics, the material forming the polishing surface of the polishing member.
Dependencies are inferred from the claim text.