Pressure applying unit

#The present application is a National Stage of PCT International Application No. PCT/JP2015/060297, filed Mar. 31, 2015.

#The present invention relates to a pressure applying unit which is used in baking a metal particle paste of an assembled body formed by arranging an electronic part on a substrate with the metal particle paste interposed therebetween by heating the assembled body while applying pressure to the assembled body using a pair of heating parts.

#In a technical field of electronic products, there has been known a bonded body where a substrate and an electronic part are bonded to each other by a baked metal particle paste. As a specific example of such a bonded body, it is possible to name a semiconductor device where a substrate on which a conductor pattern is formed and a semiconductor element are bonded to each other by a baked metal particle paste (see patent literature 1, for example).

#FIG. 1(a) and FIG. 1(b) are conceptual views of a bonded body 10. FIG. 1(a) is a top plan view, and FIG. 1(b) is a cross-sectional view (cross-sectional side view) taken along a line A1-A1 in FIG. 1(a).

#FIG. 2(a) and FIG. 2(b) are views of a pressure applying unit 100 of an embodiment 1. FIG. 2(a) is a top plan view, and FIG. 2 (b) is a cross-sectional view (cross-sectional side view) taken along a line A2-A2 in FIG. 2(a). In FIG. 2(b), for facilitating the understanding of drawing, a side surface of a distance adjusting mechanism 140 is shown but not a cross section. The same goes for cross-sectional views described hereinafter.

#FIG. 3(a) and FIG. 3(b) are views for explaining a second step S20 in a method of manufacturing a bonded body using the pressure applying unit 100 of the embodiment 1. FIG. 3(a) is a cross-sectional side view showing a state of the pressure applying unit 100 and an assembled body 20 when a pressure is not applied, and FIG. 3(b) is a cross-sectional side view showing a state where the pressure applying unit 100 and the assembled body 20 are arranged on a heating part 1000. FIG. 3(b) shows a cross section substantially equal to the cross section shown in FIG. 2(b). The same goes for FIG. 4(b), FIG. 5(a), FIG. 5(b), FIG. 6(a) and FIG. 6(b) described hereinafter.

#Hereinafter, a pressure applying unit of the present invention is described by reference to embodiments shown in the drawings.

#A pressure applying unit 100 according to an embodiment 1 is a pressure applying unit which is used in baking a metal particle paste 4 by heating an assembled body 20 where an electronic part 2 is arranged on a substrate 1 with the metal particle paste 4 interposed therebetween while applying a pressure to the assembled body 20 using a pair of heating parts 1000, 1002. The assembled body 20 is substantially equal to the assembled body 20 described previously (see FIG. 7) and hence, the repetition of the illustration and the explanation of the assembled body 20 is omitted.

#The substrate 1, the electronic part 2 and the metal particle paste 4 are described in detail.