Method for repairing semiconductor processing components
AssigneeTokai Carbon Korea Co., Ltd
InventorJoung Il Kim
Life of this patent
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Abstract
A method of repairing a semiconductor processing component is provided, in which the method includes preparing a semiconductor processing component including a tantalum carbide (TaC) coating layer on which a silicon carbide (SiC)-deposited layer is formed, and performing a thermal process on the semiconductor processing component at a temperature of 1,700° C. to 2,700° C. under a gaseous condition using at least one gas selected from the group consisting of a gas including hydrogen, a gas including chlorine, and an inert gas, or under a vacuum condition.
Claims9
A method of repairing a semiconductor processing component, the method comprising:
- preparing a semiconductor processing component comprising a tantalum carbide (TaC) coating layer on which a silicon carbide (SiC)-deposited layer is formed;
- and
- performing a thermal process on the semiconductor processing component at a temperature of 1,700° C. to 2,700° C. under a gaseous condition using at least one gas selected from the group consisting of a gas comprising hydrogen, a gas comprising chlorine, and an inert gas or under a vacuum condition,
- wherein, subsequent to the performing of the thermal process, a residue comprising carbon having a thickness of 0.001 micrometer (μm) to 1 μm remains on a surface of the TaC coating layer.
A repaired semiconductor processing component, comprising:
- a tantalum carbide (TaC) coating layer, and
- wherein the semiconductor processing component is obtained through a repairing process comprising eliminating a silicon carbide (SiC)-deposited layer formed on the TaC coating layer, and
- wherein a residue comprising carbon having a thickness of 0.001 micrometer (μm) to 1 μm remains on a surface of the TaC coating layer, and
- wherein the semiconductor processing component comprises at least one selected from the group consisting of a substrate support, a ring, a gas distribution system component, and a transmission module component.
Dependencies are inferred from the claim text.