# US 9,952,004 B2 · High efficiency thermal transfer plate

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- Number: US 9,952,004 B2
- Document ID: US9952004B2
- Status: Granted
- Kind: B2
- Application number: 14/245,704
- Filed: 2014-04-04
- Published: 2014-10-16
- Granted: 2018-04-24
- Earliest claimed: 2013-04-11
- Assignees: Solid State Cooling Systems
- Applicants: Solid State Cooling Systems, Inc.
- Inventors: Lloyd Wright; Leo Chin
- Web page: https://patentgrep.com/patent/US9952004B2

## CPC

- F28F 3/02: Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence)
- F28F 3/12: Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)}
- F28F 21/04: of ceramic; of concrete; of natural stone
- F28F 21/065: {the heat-exchange apparatus employing plate-like or laminated conduits}
- F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16)

## Abstract

The present invention provides a high efficiency thermal transfer plate for providing thermal transfer to and from a fluid. More specifically the present invention provides a thermal transfer plate including a skived fin plate for improved thermal transfer between a fluid within the thermal transfer plate and the thermal transfer plate.

## Claims

### Claim 1

A skived fin thermal transfer plate for use with a thermal exchange unit, said skived fin thermal transfer plate comprising:
a thermal transfer plate body comprising a thermoplastic fluid transport area and additionally comprising an upper skived fin thermal transfer plate and a lower skived fin thermal transfer plate, and the thermoplastic fluid transport area fluid transport area bounded by multiple thermal transfer plate body sides and an upper sealing surface and a lower sealing surface;
the upper skived fin thermal transfer plate bounding the upper sealing surface to form an upper fluidic seal and comprising an upper single contiguous piece of copper comprising an upper base and multiple upper skived fins with increased roughness on a surface of the respective multiple upper skived fins, wherein the upper skived fins are positioned so that at least a portion of the upper skived fins are within the fluid transport area,
a lower skived fin plate bounding the lower sealing surface to form a lower fluidic seal and comprising a lower single contiguous piece of copper comprising a lower base including a smooth heat transfer surface and multiple lower skived fins with increased roughness on a surface of the respective multiple lower skived fins, wherein the lower skived fins are positioned so that at least a portion of the lower skived fins are within the fluid transport area; and
a fluid inlet in fluid communication with the fluid transport area and a fluid outlet also in fluid communication with the fluid transport area.

### Claim 2 (depends on 1)

The skived fin thermal transfer plate of claim 1 wherein the thermal transfer plate body additionally comprises a tubing nozzle in the fluid inlet and a tubing nozzle in the fluid outlet for transporting a fluid into and out of the thermal transfer plate body, and said fluid inlet and said fluid outlet are located on a same side of the thermal transfer plate body.

### Claim 3 (depends on 2)

The skived fin thermal transfer plate of claim 2, additionally comprising a seal for sealing the skived fin plate to the thermal transfer plate body.

### Claim 4 (depends on 3)

The skived fin thermal transfer plate of claim 3, wherein seal is capable of containing a fluid within the fluid transport area other than the fluid inlet and the fluid outlet.

### Claim 5 (depends on 4)

The skived fin thermal transfer plate of claim 4 where the seal comprises a gasket material.

### Claim 6 (depends on 4)

The skived fin thermal transfer plate of claim 4 wherein the seal comprises an O-Ring.

### Claim 7 (depends on 4)

The skived fin thermal transfer plate of claim 4 additionally comprising fluid flow channels for guiding a fluid through the thermal transfer plate body.

### Claim 8 (depends on 4)

The skived fin thermal transfer plate of claim 4 wherein thermal transfer occurs between a fluid in the fluid transport area and the skived fins included in the skived fin plate.

### Claim 9 (depends on 7)

The skived fin thermal transfer plate of claim 7 where the fluid flow channels form a serpentine pattern.

### Claim 10 (depends on 1)

The skived fin thermal transfer plate of claim 1 additionally comprising one or more fastening mechanisms to fixedly fastening the one or more skived fin thermal transfer plates to the thermal transfer plates body.

### Claim 11 (depends on 1)

The skived fin thermal transfer plate of claim 1 wherein the thermoplastic fluid transport area comprises a material of lighter weight than the copper comprising the lower skived fin plate and the material of lighter weight comprises a thermal expansion coefficient closely matching the thermal coefficient of copper.

### Claim 12 (depends on 11)

The skived fin thermal transfer plate of claim 11 additionally comprising two or more fasteners positioned interior to the multiple sides of the body.

### Claim 13 (depends on 12)

The skived fin thermal transfer plate of claim 12 wherein the fasteners comprise a threaded bolt.
