Multilayer structure having at least one metal layer and at least one polyamide layer
AssigneeEms-Patent AG
InventorsGeorg Stoppelmann, Gabriel Garcia
Life of this patent
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AssigneeEms-Patent AG
InventorsGeorg Stoppelmann, Gabriel Garcia
Estimating the term…
A layer structure having at least one metal element and at least one polyamide layer arranged at least regionally on the metal element, the structure preferably comprising an insulated electrical conductor wherein The polyamide layer consists of a polyamide molding composition consisting of the following components: (a) a polyamide based on cycloaliphatic diamines or cycloaliphatic dicarboxylic acids having a glass transition temperature (Tg) of at 130° C.; (b) a polyolefin based on C2-C12 alkenes, and additionally on at least one monomer selected from the following group: maleic anhydride, itaconic anhydride, glycidyl acrylate, butene, propylene, glycidyl methacrylate, acrylic acid, methacrylic acid, vinyl acetate, C1-C12 alkyl (meth)acrylates, substituted or unsubstituted styrene, or a mixture of such monomers; (c) optionally an aliphatic polyamide different from (a), or a mixture of such polyamides; (d) optionally additives.
A layer structure—having at least one metal element—and at least one polyamide layer—arranged at least regionally on the metal element,
A method for generating a polyamide layer on a metal element comprising:
A method for generating an electrical conductor insulated with a polyamide layer, comprising:
Dependencies are inferred from the claim text.