Back to results
US 9,945,032 B2Granted
Systems and methods for enhancing mobility of atomic or molecular species on a substrate at reduced bulk temperature using acoustic waves, and structures formed using same
AssigneeThe Aerospace Corporation
InventorHenry Helvajian
Life of this patent
Estimating the term…
Abstract
Under one aspect, a structure is provided that includes a substrate including a first material having a threshold temperature above which the first material is damaged and a layer consisting essentially of a second material molecularly bonded to the first material of the substrate. The second material is formed on the substrate at a reaction temperature that is higher than the threshold temperature of the first material. An interface between the substrate and the second material is a substantially defect-free surface.
Claims3
A structure comprising:
- a substrate comprising a first material having a threshold temperature above which the first material is damaged;
- and
- a layer consisting essentially of silicon nitride, graphene, diamond, titanium dioxide, titanium boride, zirconium oxide, yttria-stabilized zirconium, boron carbide, boron nitride, or metal molecularly bonded to the first material of the substrate, the layer being formed on the substrate at a reaction temperature that is higher than the threshold temperature of the first material, wherein an interface between the substrate and the layer comprises annealed kinks, annealed terraces, or annealed slip faults.
Dependencies are inferred from the claim text.