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US 9,943,930 B2Granted
Composition of a solder, and method of manufacturing a solder connection
AssigneesKoninklijke Philips N.V., Mat-Tech B.V.
InventorsNicolaas Johannes Antonius Van Veen, Mohammad Hossain Biglari
Life of this patent
Estimating the term…
Abstract
The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.
Claims7
A structure comprising:
- a substrate with a bonding area comprising a metal that oxidizes on contact with air;
- a layer of a solder composition disposed over the bonding area, wherein particles of a thermodynamically metastable alloy are dispersed in the solder composition;
- and
- an adhesion layer comprising an intermetallic compound, the intermetallic compound comprising the metal that oxidizes on contact with air and an element of the thermodynamically metastable alloy, wherein the adhesion layer is disposed between the metal that oxidizes on contact with air and the layer of solder composition.
1 more element
Dependencies are inferred from the claim text.