A method for closely connecting an organic optoelectronic component to a connection piece, the method comprising:
- forming a first cavity in the organic optoelectronic component, wherein the first cavity has at least one first opening;
- introducing a connection structure through the first opening into the first cavity,
- wherein the introduced connection structure has a first fixing region, wherein the first fixing region of the connection structure is designed at least partly complementarily to the form of the first cavity;
- forming a second cavity in the connection piece, wherein the second cavity has at least one second opening;
- wherein the second cavity is designed at least partly complementarily to the form of a second fixing region of the introduced connection structure;
- introducing the second fixing region of the connection structure through the second opening into the second cavity;
- and
- forming a force-locking connection of the organic optoelectronic component to the connection piece after the connection structure has been introduced into the first cavity and the second cavity, and
- wherein during or after the process of forming the close connection of the organic optoelectronic component to the connection piece by the connection structure, an electrical connection between the optoelectronic component and the connection piece is additionally formed.