Method and apparatus for transfer lamination
AssigneeHazen Paper Company
InventorsRobert Hazen, Keith McCrodden
Life of this patent
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Abstract
An embodiment of the inventive method of transfer lamination involves metallizing a first side of a film and then bonding the metallized first side to a substrate. Then a coating is applied to a second side of the film after it has been bonded to the substrate. The bonded film and substrate are then placed in an oven. The film is then stripped from the substrate leaving metal from the film deposited on the substrate. The application of the coating is performed as an inline part of the transfer lamination process thereby providing an ease of manufacture presently unknown.
Claims17
A method for transfer lamination, said method comprising the steps of:
- metallizing a first side of a film;
- bonding said metallized first side of said film to a substrate;
- applying a first coating to a second side of said film at a first gravure station after it has been bonded to said substrate and while it is bonded to said substrate such that said substrate imparts rigidity to said film while said first coating is applied to said second side of said film in order to achieve a uniform application of said first coating on said second side of said film;
- curing said bonded film and substrate in a first oven;
- and
- removing said film from said substrate leaving metal from said film deposited on said substrate thereby producing a metalized substrate;
- wherein said application of said first coating is performed as an inline part of a transfer lamination process.
A method for transfer lamination, said method comprising the steps of:
- metallizing a first side of a film;
- bonding said metallized first side of said film to a substrate;
- applying a first coating to an exposed, second side of said film while said metallized first side of said film is bonded to said substrate, such that said substrate imparts rigidity to said film while said first coating is applied to said exposed, second side of said film;
- curing said bonded film and substrate;
- and
- removing said film with said first coating on said second side thereof from said substrate leaving metal from said first side of said film deposited on said substrate thereby producing a metalized substrate and said film coated with said first coating on said second side thereof;
- wherein said applications of said first coating is performed as an inline part of a transfer lamination process.
A system for transfer lamination of a substrate, said system comprising:
- a bonding station for bonding a metallized first side of a film to a substrate;
- a first coating station for applying a first coating to an exposed, second side of said film after said metallized first side of said film is bonded to said substrate and while it is bonded to said substrate, said substrate imparting rigidity to said film while said first coating is applied;
- a first curing station for curing said bonded film and substrate;
- and
- a stripping station for removing said film from said substrate to produce a metallized substrate ready for printing and a transfer film having a coating on said second side of said film.
Dependencies are inferred from the claim text.