High-frequency module

A high-frequency module comprising:

• a first external connection terminal;
• a second external connection terminal;
• a filter unit connected between the first external connection terminal and the second external connection terminal;
• a matching circuit connected between at least one of the first external connection terminal and the second external connection terminal and the filter unit;
• an inductor connected between a ground and the filter unit;
• a filter substrate including IDT electrodes that define the filter unit and that are provided on a first principal surface of the filter substrate;
• a cover layer positioned in an opposing relation to the first principal surface of the filter substrate with a spacing defined therebetween;
• a connection electrode projecting from the first principal surface and penetrating through the cover layer;
• and
• a multilayer substrate including the matching circuit mounted thereto or located therein;
• wherein
• the filter unit includes:
• a first series connection terminal connected to the first external connection terminal;
• a second series connection terminal connected to the second external connection terminal;
• a plurality of series-connected filter elements connected in series between the first series connection terminal and the second series connection terminal through a plurality of connection lines;
• a shunt connection terminal connected to the ground through the inductor and connected to one of the plurality of connection lines;
• and
• a shunt-connected filter element connected between one of the plurality of connection lines to which the shunt connection terminal is connected and the shunt connection terminal;
• the inductor and the matching circuit are inductively or capacitively coupled to each other;
• the first principal surface faces a mount surface of the multilayer substrate;
• the filter substrate is connected to the multilayer substrate through the connection electrode;
• the matching circuit includes a surface mount circuit element that is mounted to a mount surface of the multilayer substrate;
• the inductor is located inside the cover layer;
• and
• the surface mount circuit element and the inductor are arranged close to each other.

A high-frequency module comprising:

• a first external connection terminal;
• a second external connection terminal;
• a filter unit connected between the first external connection terminal and the second external connection terminal;
• a matching circuit connected between at least one of the first external connection terminal and the second external connection terminal and the filter unit;
• an inductor connected between a ground and the filter unit;
• a filter substrate including IDT electrodes that define the filter unit and that are provided on a first principal surface of the filter substrate;
• a cover layer positioned in an opposing relation to the first principal surface of the filter substrate with a spacing defined therebetween;
• a connection electrode projecting from the first principal surface and penetrating through the cover layer;
• and
• a multilayer substrate including the matching circuit mounted thereto or located therein;
• wherein
• the filter unit includes:
• a first series connection terminal connected to the first external connection terminal;
• a second series connection terminal connected to the second external connection terminal;
• a plurality of series-connected filter elements connected in series between the first series connection terminal and the second series connection terminal through a plurality of connection lines;
• a shunt connection terminal connected to the ground through the inductor and connected to one of the plurality of connection lines;
• and
• a shunt-connected filter element connected between one of the plurality of connection lines to which the shunt connection terminal is connected and the shunt connection terminal;
• the inductor and the matching circuit are inductively or capacitively coupled to each other;
• the first principal surface faces a mount surface of the multilayer substrate;
• the filter substrate is connected to the multilayer substrate through the connection electrode;
• the matching circuit includes a surface mount circuit element that is mounted to the mount surface of the multilayer substrate;
• the inductor is mounted to the mount surface of the multilayer substrate or located inside of the multilayer substrate;
• the surface mount circuit element and the inductor are arranged close to each other;
• and
• a shortest distance between the connection lines located on the filter substrate and the surface mount circuit element is longer than a shortest distance between the surface mount circuit element and the inductor.

A high-frequency module comprising:

• a first external connection terminal;
• a second external connection terminal;
• a filter unit connected between the first external connection terminal and the second external connection terminal;
• a matching circuit connected between at least one of the first external connection terminal and the second external connection terminal and the filter unit;
• an inductor connected between a ground and the filter unit;
• a filter substrate including IDT electrodes that define the filter unit and that are provided on a first principal surface of the filter substrate;
• a cover layer positioned in an opposing relation to the first principal surface of the filter substrate with a spacing defined therebetween;
• a connection electrode projecting from the first principal surface and penetrating through the cover layer;
• and
• a multilayer substrate including the matching circuit mounted thereto or located therein;
• wherein
• the filter unit includes:
• a first series connection terminal connected to the first external connection terminal;
• a second series connection terminal connected to the second external connection terminal;
• a plurality of series-connected filter elements connected in series between the first series connection terminal and the second series connection terminal through a plurality of connection lines;
• a shunt connection terminal connected to the ground through the inductor and connected to one of the plurality of connection lines;
• and
• a shunt-connected filter element connected between one of the plurality of connection lines to which the shunt connection terminal is connected and the shunt connection terminal;
• the inductor and the matching circuit are inductively or capacitively coupled to each other;
• the first principal surface faces a mount surface of the multilayer substrate;
• the filter substrate is connected to the multilayer substrate through the connection electrode;
• the matching circuit includes a surface mount circuit element that is mounted to the mount surface of the multilayer substrate;
• the inductor is mounted to the mount surface of the multilayer substrate or located inside of the multilayer substrate;
• the surface mount circuit element and the inductor are arranged close to each other;
• and
• the inductor generates a magnetic field perpendicular or substantially perpendicular to magnetic fields that are generated from the connection lines located on the filter substrate.

A high-frequency module comprising:

• a first external connection terminal;
• a second external connection terminal;
• a filter unit connected between the first external connection terminal and the second external connection terminal;
• a matching circuit connected between at least one of the first external connection terminal and the second external connection terminal and the filter unit;
• an inductor connected between a ground and the filter unit;
• a filter substrate including IDT electrodes that define the filter unit and that are provided on a first principal surface of the filter substrate;
• a cover layer positioned in an opposing relation to the first principal surface of the filter substrate with a spacing defined therebetween;
• a connection electrode projecting from the first principal surface and penetrating through the cover layer;
• and
• a multilayer substrate including the matching circuit mounted thereto or located therein;
• wherein
• the filter unit includes:
• a first series connection terminal connected to the first external connection terminal;
• a second series connection terminal connected to the second external connection terminal;
• a plurality of series-connected filter elements connected in series between the first series connection terminal and the second series connection terminal through a plurality of connection lines;
• a shunt connection terminal connected to the ground through the inductor and connected to one of the plurality of connection lines;
• and
• a shunt-connected filter element connected between one of the plurality of connection lines to which the shunt connection terminal is connected and the shunt connection terminal;
• the inductor and the matching circuit are inductively or capacitively coupled to each other;
• the first principal surface faces a mount surface of the multilayer substrate;
• the filter substrate is connected to the multilayer substrate through the connection electrode;
• the matching circuit includes a surface mount circuit element that is mounted to the mount surface of the multilayer substrate;
• the inductor is mounted to the mount surface of the multilayer substrate or located inside of the multilayer substrate;
• the surface mount circuit element and the inductor are arranged close to each other;
• and
• the inductor is arranged close to a predetermined side of the filter substrate, the predetermined side being different from a side of the filter substrate positioned closest to the connection lines in the filter substrate.

A high-frequency module comprising:

• a first external connection terminal;
• a second external connection terminal;
• a filter unit connected between the first external connection terminal and the second external connection terminal;
• a matching circuit connected between at least one of the first external connection terminal and the second external connection terminal and the filter unit;
• an inductor connected between a ground and the filter unit;
• a filter substrate including IDT electrodes that define the filter unit and that are provided on a first principal surface of the filter substrate;
• a cover layer positioned in an opposing relation to the first principal surface of the filter substrate with a spacing defined therebetween;
• a connection electrode projecting from the first principal surface and penetrating through the cover layer;
• and
• a multilayer substrate including the matching circuit mounted thereto or located therein;
• wherein
• the filter unit includes:
• a first series connection terminal connected to the first external connection terminal;
• a second series connection terminal connected to the second external connection terminal;
• a plurality of series-connected filter elements connected in series between the first series connection terminal and the second series connection terminal through a plurality of connection lines;
• a shunt connection terminal connected to the ground through the inductor and connected to one of the plurality of connection lines;
• and
• a shunt-connected filter element connected between one of the plurality of connection lines to which the shunt connection terminal is connected and the shunt connection terminal;
• the inductor and the matching circuit are inductively or capacitively coupled to each other;
• the first principal surface faces a mount surface of the multilayer substrate;
• the filter substrate is connected to the multilayer substrate through the connection electrode;
• the matching circuit includes a surface mount circuit element that is mounted to the mount surface of the multilayer substrate;
• the inductor is mounted to the mount surface of the multilayer substrate or located inside of the multilayer substrate;
• the surface mount circuit element and the inductor are arranged close to each other;
• the matching circuit includes:
• a rectangular or substantially rectangular parallelepiped casing;
• and
• a spiral conductor located inside the casing and having a rectangular or substantially rectangular outer peripheral shape when looking at the high-frequency module in a plan view;
• and
• the matching circuit is arranged such that a long side of the casing is close to the inductor.