Methods and apparatus for preparing power transmission cables
AssigneesTyco Electronics Raychem GmbH, Te Connectivity Corporation
InventorsLadislaus Kehl, Terry Edward Frye
Life of this patent
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Abstract
A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.
Claims13
A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer, the method comprising:
- cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove;
- and thereafter
- removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer;
- wherein the direction of rotation of the grinding surface is transverse to a groove plane defined by a circumference of the dividing groove.
A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer, the method comprising:
- cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove;
- and thereafter
- removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer;
- wherein the grinding surface has a rounded cross-sectional profile having a rounded side surface when sectioned along a groove plane defined by a circumference of the dividing groove.
A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer, and a cable jacket surrounding the semiconductive layer, the method comprising:
- cutting away an end section of the cable jacket to expose the semiconductive layer;
- thereafter
- cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove;
- and thereafter
- removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer;
- wherein the axis of rotation of the grinding surface is transverse to a lengthwise cable axis of the cable.
Dependencies are inferred from the claim text.