# US 9,929,036 B2 · System and method for peeling a semiconductor chip from a tape using a multistage ejector > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,929,036 B2 - Document ID: US9929036B2 - Status: Granted - Kind: B2 - Application number: 15/319,259 - Filed: 2015-05-13 - Published: 2017-05-11 - Granted: 2018-03-27 - Earliest claimed: 2014-06-18 - Assignees: Manufacturing Integration Technology Ltd - Applicants: Manufacturing Integration Technology Ltd - Inventors: Kim Mone Kwong; Kok Yeow Lim; Zhiqiang Mao - Web page: https://patentgrep.com/patent/US9929036B2 ## CPC - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape} - H10P 72/78: using vacuum or suction, e.g. Bernoulli chucks - H10P 72/7414: {the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support} - H10P 72/7416: {used during dicing or grinding} - H10P 72/742: {involving stretching of the auxiliary support post dicing} - H10P 72/7428: {used to support diced chips prior to mounting} - H10P 72/7442: {Separation by peeling} - Y10S 156/932: with poking during delaminating, e.g. jabbing release sheet backing to remove wafer - Y10S 156/943: with poking delaminating means, e.g. jabbing means - Y10T 156/1132: Using vacuum directly against work during delaminating - Y10T 156/1179: with poking during delaminating [e.g., jabbing, etc.] - Y10T 156/1944: Vacuum delaminating means [e.g., vacuum chamber, etc.] - Y10T 156/1983: Poking delaminating means - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural sets of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip. A vacuum source is utilized for generating vacuum to suck the tape. Plural sets of contacts such as inner, middle and outer contacts are independently or together moved below the tape at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each contact to effectively remove or loosen the tape from the chip. A pick and place unit can then pick up the chip easily without any damage to chip. ## Claims ### Claim 1 A system for peeling a semiconductor chip from a tape comprising: a housing having a top surface, wherein the top surface is positioned under the tape on which the chip is attached; an inner set of tape removing contacts located at the center of the top surface of the housing; a middle set of tape removing contacts surrounding the inner set of tape removing contacts; an outer set of tape removing contacts surrounding the middle set of tape removing contacts, a plurality of vacuum channels surrounding the inner, middle and outer sets of tape removing contacts; a vacuum source coupled to the plurality of vacuum channels for creating a vacuum to hold the tape; and a controller for controlling the vacuum source and the inner, middle and outer sets of tape removing contacts, wherein each set of the inner, middle and outer sets of tape removing contacts is capable of moving independently or together with other sets; wherein the controller triggers individual or collective movement of the inner, middle and outer set of tape removing contacts; wherein the chip is removed from the tape due to movement of the inner, middle and outer sets of tape removing contacts after the vacuum source is activated; wherein an actuation mechanism and the controller independently control movements of each set of tape removing contacts; wherein each set of the inner, middle and outer sets of tape removing contacts is coupled to a respective actuation mechanism that facilitates the movement of tape removing contacts based upon a trigger received from the controller; and wherein the tape removing contacts are pins or needles. ### Claim 2 (depends on 1) The system of claim 1, wherein the inner set of tape removing contacts has a first shaped contact area, the middle set of tape removing contacts has a second shaped contact area and the outer set of tape removing contacts has a third shaped contact area. ### Claim 3 (depends on 1) The system of claim 1, further comprising a pickup and place unit operatively coupled to the free surface of the chip, wherein the pickup and place unit removes the chip from the tape once the chip is loosened from the tape. ### Claim 4 (depends on 1) The system of claim 1, wherein the housing comprises a pepper pot. ### Claim 5 (depends on 1) The system of claim 1, wherein the plurality of vacuum channels are concentric. ### Claim 6 A method for peeling a semiconductor chip from a tape comprising the steps of: placing an inner set, a middle set and an outer set of tape removing contacts under the tape on which the chip is attached; coupling a pickup and place unit to the free surface of the chip; activating a controller to operate a vacuum in conjunction with an actuator mechanism; creating a vacuum for holding the tape to the top surface of a housing; moving the inner, middle and outer sets of tape removing contacts upward by a first predefined distance; simultaneously, moving the pickup and place unit upward by the first predefined distance; moving the outer sets of tape removing contacts downward; moving subsequently the middle set of tape removing contacts downward; moving thereafter the inner set of tape removing contacts downward, leaving the chip coupled to the pickup and place unit; and removing the chip using the pickup and place unit after all of the sets of tape removing contacts are moved downward; wherein the actuation mechanism and controller independently control movements of each set of tape removing contacts; wherein each set of the inner, middle and outer sets of tape removing contacts is coupled to a respective actuation mechanism that facilitates the movement of tape removing contacts based upon a trigger received from the controller; and wherein the tape removing contacts are pins or needles. ### Claim 7 (depends on 6) The method of claim 6, wherein the moving of each set of the tape removing contacts are under the control of the controller. ### Claim 8 (depends on 6) The method of claim 6, further comprising the step of turning off the vacuum after the chip is removed. ### Claim 9 A method for peeling a semiconductor chip from a tape, comprising the steps of: placing an inner, middle and outer set of tape removing contacts under the tape on which the chip is attached; coupling a pickup and place unit to the free surface of the chip; activating a controller to operate a vacuum in conjunction with an actuator mechanism; creating a vacuum for holding the tape to the top surface of a housing; moving the each sets of tape removing contacts upward by a first predefined distance while simultaneously moving the pickup and place unit upward by the first predefined distance; moving upward the middle and inner sets of tape removing contacts by a second predefined distance while simultaneously moving the pickup and place unit upward by the second predefined distance; moving upward the inner set of tape removing contacts by a third predefined distance while simultaneously moving the pickup and place unit upward by the third predefined distance; and removing the chip using the pickup and place unit when only one set of tape removing contacts is attached to the tape; wherein the actuation mechanism and controller independently control movements of each set of tape removing contacts; wherein each set of the inner, middle and outer sets of tape removing contacts is coupled to a respective actuation mechanism that facilitates the movement of tape removing contacts based upon a trigger received from the controller; and wherein the tape removing contacts are pins or needles. ### Claim 10 (depends on 9) The method of claim 9, further comprising the step of turning off the vacuum after the chip is removed. ### Claim 11 A method for peeling a semiconductor chip from a tape, the method comprising the steps of: placing an inner set, middle set and outer set of tape removing contacts under the tape on which the chip is attached; coupling a pickup and place unit to the free surface of the chip; creating a vacuum for holding the tape firmly to the top surface of a housing; moving the outer and inner sets of tape removing contacts upwards by a first predefined distance; simultaneously, moving the pickup and place unit upwards by the first predefined distance; selectively moving one set of the outer and inner sets of tape removing contacts downward by the first predefined distance and the other set of the outer and inner sets of tape removing contacts upward by a second predefined distance while simultaneously moving the pickup and place unit upward by the second predefined distance; moving the middle set of tape removing contacts upward by a third predefined distance while simultaneously moving the pickup and place unit upward by the third predefined distance to loosen the tape from the chip; and removing the chip using the pickup and place unit; wherein an actuation mechanism and controller independently control movement of each set of tape removing contacts; wherein each set of the inner, middle and outer sets of tape removing contacts is coupled to a respective actuation mechanism that facilitates the movement of tape removing contacts based upon a trigger received from the controller; and wherein the tape removing contacts are pins or needles.