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US 9,924,601 B2Granted
Method for the metallation of a workpiece and a layer structure made up of a workpiece and a metal layer
AssigneeLpkf Laser & Electronics AG
InventorsRoman Ostholt, Robin Alexander Krueger, Bernd Roesener, Eugen Haumann
Life of this patent
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Abstract
A method for the at least portion-wise and adhesive metallization of a non-conductive workpiece includes introducing periodic microstructures into the workpiece in regions to be metallized, within an area to be metallized that is enclosed by one or more limiting lines, by molding a tool that is microstructured in accordance with the regions to be metallized within a molding area.
Claims14
A method for the at least portion-wise and adhesive metallisation of a non-conductive workpiece, the method comprising:
- producing periodic self-organizing microstructures having a conical shape in a surface of a moulding tool by laser radiation with a pulse length of less than one nanosecond;
- introducing the microstructures into the workpiece in regions to be metallised, within an area to be metallised that is enclosed by one or more limiting lines, by the moulding tool that is microstructured in accordance with the regions to be metallised within a moulding area such that the microstructures form a negative contour in a surface of the work piece;
- seeding a region of the negative contour with metal seeds which adhere only in the region of the negative contour;
- and
- performing a metallisation, proceeding from the seeds, so as to form a metal layer in the regions to be metallised that covers the microstructures of the negative contour.
2 more elements
Dependencies are inferred from the claim text.