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US 9,922,824 B2Granted
Method of forming silicon film
AssigneeTokyo Electron Limited
InventorMitsuhiro Okada
Life of this patent
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Abstract
A method of forming a silicon film on a target surface of a target object, including: performing a gas process on the target surface of the target object using an oxygen gas and a hydrogen gas; forming the silicon film on the target surface to which the gas process has been performed, wherein the performing a gas process and the forming the silicon film are performed within a single processing chamber.
Claims18
A method of forming a silicon film on a target surface of a target object, comprising:
- performing an impurity removal process on the target surface of the target object using an oxygen gas and a hydrogen gas;
- forming the silicon film on the target surface to which the impurity removal process has been performed by supplying a silicon raw material gas to the target surface of the target object,
- wherein the performing a impurity removal process and the forming the silicon film are performed within a single processing chamber, and
- wherein after performing the impurity removal process before forming the silicon film on the target surface, the processing chamber is purged with an inert gas.
1 more element
Dependencies are inferred from the claim text.