Peeling device, peeling system and peeling method

A peeling system for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, the peeling system comprising:

• a peeling process station configured to perform a predetermined process on the substrate to be processed, the support substrate and the overlapped substrate;
• a carry-in/carry-out station configured to carry the substrate to be processed, the support substrate or the overlapped substrate in and out of the peeling process station;
• and
• a transfer station configured to transfer the substrate to be processed, the support substrate or the overlapped substrate between the peeling process station and the carry-in/carry-out station,
• wherein the peeling process station includes:
• a peeling device configured to peel off the substrate to be processed and the support substrate from the overlapped substrate;
• and
• a first cleaning device configured to clean the substrate to be processed which is peeled by the peeling device;
• a second cleaning device configured to clean the support substrate which is peeled by the peeling device;
• wherein the peeling device includes:
• a first holding unit provided with a heating mechanism to heat the substrate to be processed and configured to hold the substrate to be processed in a horizontal orientation;
• a second holding unit provided with a heating mechanism to heat the support substrate and configured to hold the support substrate in a horizontal direction;
• a moving mechanism configured to move at least one of the first holding unit and the second holding unit relative to each other in a horizontal direction;
• and
• an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed which is exposed by moving the first holding unit and the second holding unit relative to each other in the horizontal direction by the moving mechanism,
• wherein the inert gas supply mechanism includes a porous portion with a plurality of holes formed in the porous portion and a gas supply pipe connected to the porous portion to supply the inert gas to the porous portion, and
• wherein the porous portion is provided to be vertically spaced apart from the bonding surface of the substrate to be processed by a predetermined distance.

A method for peeling off a substrate to be processed and a support substrate from an overlapped substrate using a peeling device, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive,

• wherein the peeling device includes:
• a first holding unit provided with a heating mechanism to heat the substrate to be processed and configured to hold the substrate to be processed in a horizontal direction;
• a second holding unit provided with a heating mechanism to heat the support substrate and configured to hold the support substrate in a horizontal direction;
• a moving mechanism configured to move at least one of the first holding unit and the second holding unit relative to each other in a horizontal direction;
• and
• an inert gas supply mechanism configured to supply an inert gas onto the substrate to be processed,
• wherein the inert gas supply mechanism includes a porous portion with a plurality of holes formed in the porous portion and a gas supply pipe connected to the porous portion to supply the inert gas to the porous portion,
• wherein the porous portion is provided to be vertically spaced apart from a bonding surface of the substrate to be processed by a predetermined distance,
• the method comprising:
• peeling off the substrate to be processed and the support substrate from the overlapped substrate by moving the first holding unit and the second holding unit relative to each other in the horizontal direction while heating the substrate to be processed held by the first holding unit and the support substrate held by the second holding unit;
• and
• spacing the porous portion apart from a bonding surface of the substrate to be processed by a predetermined distance in a vertical direction, and supplying the inert gas from the porous portion to the bonding surface of the substrate to be processed exposed by the peeling,
• wherein the porous portion is formed in a flat plate shape enough to cover the substrate to be processed as viewed from the top,
• wherein an end portion of the porous portion in a moving direction of the porous portion is formed in a concave shape in conformity to a shape of the substrate to be processed as viewed from the top,
• wherein the porous portion is disposed to be brought the concave portion thereof into contact with the substrate to be processed as viewed from the top, and
• wherein the supply of the inert gas is initiated at least before the bonding surface of the substrate to be processed is exposed by the peeling.