Flux and solder material and method of making same
AssigneeNordson Corporation
InventorJohn A. Vivari, Jr.
Life of this patent
Estimating the term…
Abstract
A flux for use in soldering comprises a first constituent and one or more secondary constituents that is selected from solvents, thickeners, and/or metal oxide reducing agents. The flux has a temperature profile in which the flux is in a non-flowable inactive state at temperatures at and below a maximum storage temperature that is above about 27° C., a liquid active state at an activation temperature, and a flowable inactive state in a deposition temperature range above the maximum storage temperature and below the activation temperature. A solder material comprises solder particles dispersed in the flux.
Claims27
A solder material comprising:
- a solder/flux mixture of solder particles dispersed in a flux,
- wherein the solder/flux mixture is a solid at room temperature;
- the flux comprises a first constituent including a polyglycol and one or more secondary constituents selected from solvents, thickeners, and metal oxide reducing agents;
- the flux has a temperature profile in which the flux is in a non-flowable inactive state at temperatures at and below a maximum storage temperature, a liquid active state at an activation temperature, and a flowable inactive state in a deposition temperature range above the maximum storage temperature and below the activation temperature, the maximum storage temperature being above about 27° C., and
- the solder particles are in a liquid state at or above the activation temperature.
Dependencies are inferred from the claim text.