Thermal capacitance system

A system comprising:

• an electronic system comprising electronic components and a chassis, the chassis in thermal contact with components;
• a first modular thermal energy storage card and a second modular thermal energy storage card inserted into the chassis, the first modular thermal energy storage card stacked on top of or placed adjacent to the second modular thermal energy storage card such that the first modular thermal energy storage card and the second modular thermal energy storage card comprise one of a horizontal or a vertical stack, wherein the stack provides cooling to the electronic system, the first modular thermal energy storage card and the second modular thermal energy storage card each comprising:
• a thermally conductive enclosure bounding an interior cavity;
• a cell wall structure comprising a plurality of cells disposed within the interior cavity and in thermal communication with the thermally conductive enclosure;
• a phase change material having a melting point, the phase change material disposed within the plurality of cells and in thermal communication with cell walls of the plurality of cells;
• a thermally conductive interface disposed between the thermally conductive enclosure and the chassis, the thermally conductive interface extending from the interior cavity a distance beyond the interior cavity of the enclosure and in contact with the chassis.

A system comprising:

• an electronic system comprising electronic components and a chassis, the chassis in thermal contact with components;
• a first modular thermal energy storage card and a second modular thermal energy storage card inserted into the chassis, the first modular thermal energy storage card placed adjacent to the second modular thermal energy storage card such that the first modular thermal energy storage card and the second modular thermal energy storage card comprise one of a horizontal stack, wherein the stack provides cooling to the electronic system, the first modular thermal energy storage card and the second modular thermal energy storage card each comprising:
• a thermally conductive enclosure bounding an interior cavity;
• a cell wall structure comprising a plurality of cells disposed within the interior cavity and in thermal communication with the thermally conductive enclosure;
• a phase change material having a melting point, the phase change material disposed within the plurality of cells and in thermal communication with cell walls of the plurality of cells;
• a thermally conductive interface,
• wherein the thermally conductive interface of the first modular thermal energy storage card is disposed between the thermally conductive enclosure of the first modular thermal energy storage card and the chassis and extending from the interior cavity of the first modular thermal energy storage card a first distance beyond the interior cavity of the enclosure of the first modular thermal energy storage card and in contact with the chassis, and
• wherein the thermally conductive interface of the second modular thermal energy storage card is disposed between the thermally conductive enclosure of the second modular thermal energy storage card and a heat generating surface of the first modular thermal energy storage card, the thermally conductive interface of the second modular thermal energy storage card extending from the interior cavity of the second modular thermal energy storage card a second distance beyond the interior cavity of the enclosure of the second modular thermal energy storage card and in contact with the heat generating surface of the first modular thermal energy storage card;
• and
• a frame, wherein the frame is fitted over the horizontal stack to secure the first modular thermal energy storage card and the second modular thermal energy storage card adjacent to each other, the frame comprising a thermal conductive material wherein the frame transfers heat from the first modular thermal energy storage card to the second modular thermal energy storage card.