Method of cooling series-connected heat sink modules
AssigneeEbullient, Inc.
InventorsTimothy A. Shedd, Brett A. Lindeman
Life of this patent
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AssigneeEbullient, Inc.
InventorsTimothy A. Shedd, Brett A. Lindeman
Estimating the term…
A method of cooling two or more heat-providing surfaces using a cooling apparatus having two or more fluidly connected heat sink modules in a series configuration can include providing a flow of single-phase liquid coolant to a first heat sink module mounted on a first heat-providing surface. The method can include projecting the flow of single-phase liquid coolant against the first heat-providing surface within the first heat sink module and causing phase change of a first portion of the liquid coolant and thereby forming two-phase bubbly flow with a first quality. The method can include transporting the two-phase bubbly flow to a second heat sink module and projecting the two-phase bubbly flow against a second heat-providing surface within the second heat sink module and causing phase change of a second portion of the coolant and formation of two-phase bubbly flow with a second quality greater than the first quality.
A method of cooling two heat-providing surfaces within a server using a cooling apparatus comprising two series-connected heat sink modules, the method comprising:
A method of cooling two or more heat-providing surfaces using a cooling apparatus comprising two or more fluidly connected heat sink modules arranged in a series configuration, the method comprising:
A method of cooling two heat-providing surfaces within a server using a cooling apparatus comprising two series-connected heat sink modules, the method comprising:
Dependencies are inferred from the claim text.