Method and apparatus for transferring pixel data for electron beam lithography
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorYu-Chi Chen
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a substrate is disclosed. The method includes receiving a plurality of pixel elements, wherein each of the pixel elements includes data members; and transferring the data members to a plurality of exposing devices that are configured to conditionally expose the substrate with an incident energy beam when coupled with the data members, wherein different data members of one pixel element are transferred at different system cycles.
Claims20
A method of manufacturing a substrate, the method comprising the steps of:
- receiving a plurality of pixel elements, wherein each of the pixel elements includes data members;
- generating a control bit map by rearranging the data members and introducing dummy data for delay in the control bit map, and by encoding a data member with another data member of a same pixel element to place encoded data members into the control bit map;
- transferring the data members, encoded data members, and the dummy data to a plurality of electron beam (e-beam) mirrors according to the control bit map, wherein each data member, encoded data member, and dummy data are to be coupled with more than one e-beam mirrors in series and the dummy data do not cause the e-beam mirrors to expose the substrate, wherein different data members and encoded data members of one pixel element are transferred at different system cycles;
- and
- exposing the substrate with the e-beam mirrors and the data members and the encoded data members.
A method of exposing a wafer, comprising the steps of:
- receiving a first pixel element, wherein the first pixel element includes first and second members and corresponds to a first portion of the wafer;
- generating a control bit map by assigning the first member to a first plurality of electron beam (e-beam) mirrors and assigning a dummy data and an encoded second member to a second plurality of e-beam mirrors, wherein the dummy data is to be coupled to the second plurality when the first member is coupled to the first plurality, the encoded second member is an XOR of the first and second members, and wherein the encoded second member is to be coupled to the second plurality after the first member has been coupled to all members of the first plurality;
- storing the control bit map in a storage element;
- transmitting the first member to the first plurality of electron beam (e-beam) mirrors and the dummy data and the encoded second member to the second plurality of e-beam mirrors according to the control bit map;
- and
- exposing the first portion with the first plurality.
A system comprising:
- first and second pluralities of electron beam (e-beam) mirrors, wherein each e-beam mirror is operable to conditionally expose a substrate with an incident e-beam;
- and
- a control element, configured to generate a control bit map by assigning a first data to the first plurality and assigning dummy data and a second data to the second plurality, wherein the first data and the dummy data are coupled to the respective first and second pluralities at the same time per system cycle and the dummy data is used to maintain no action of the second plurality, and wherein:
- the first data corresponds to a first member of a first pixel element that is to be coupled with each of the first plurality in series,
- the second data is an XOR of the first data and a second member of the first pixel element that is to be coupled with each of the second plurality in series,
- the first pixel element corresponds to portions of an integrated circuit (IC) layout.
Dependencies are inferred from the claim text.