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US 9,895,902 B2Granted
Compliant micro device transfer head
AssigneeApple Inc.
InventorsAndreas Bibl, John A. Higginson, Hsin-Hua Hu
Life of this patent
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Abstract
A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
Claims14
A transfer head array comprising:
- a base substrate;
- an array of spring members, each spring member including:
- a spring anchor coupled to the base substrate;
- a spring portion including a pair of electrically separate electrodes that are deflectable towards the base substrate;
- and
- a mesa structure that protrudes away from the base substrate;
- and
- a dielectric layer covering the pair of electrically separate electrodes.
5 more elements
Dependencies are inferred from the claim text.