Floor or wall covering system with laying units which can be combined in a modular manner

An arrangement for forming a covering on a substrate, wherein the arrangement comprises:

• a plurality of substrate laying units, which can be laid together on the substrate to cover the substrate and can be connected to the substrate,
• wherein one substrate laying unit comprises:
• a stability layer, which is rigid in a board-like manner, for stabilizing a surface laying unit, which can be attached above the stability layer;
• and
• a connecting structure, which is attached directly to an upper side of the substrate laying unit and is configured for connecting to the surface laying unit, wherein the connecting structure does not comprise a portion of a hook-and-loop fastener;
• wherein an underside of the substrate laying unit opposite the upper side is configured for connecting to the substrate;
• wherein a first side face of the stability layer comprises a first engagement element, and a second side face of the stability layer comprises a second engagement element, complementary to the first engagement element, wherein the first engagement element can be connected to a corresponding second engagement element and the second engagement element can be connected to a corresponding first engagement element of corresponding substrate laying units;
• a plurality of surface laying units which are provided separately from the substrate laying units and are configured to cover the laid substrate laying units, wherein one surface laying unit comprises:
• a wear layer, wherein the wear layer is produced from solid wood, has a thickness in a range between 0.5 mm and 4 mm, and is formed as a board;
• a further connecting structure, which is attached directly to the underside of the wear layer and is configured for detachably connecting the surface laying units to the substrate laying units,
• wherein the further connecting structure does not comprise a portion of a hook-and-loop fastener.