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US 9,890,307 B2Granted
Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the same
AssigneeSamsung SDI Co., Ltd.
InventorsKi Hyeok Kwon, Min Gyum Kim, Joo Young Chung, Jin Min Cheon, Jin Woo Choi, Seung Han, Dong Hwan Lee
Life of this patent
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Abstract
A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:
Claims15
A phosphonium compound represented by Formula 1:
- wherein, in Formula 1,
- R1, R2, R3, and R4 are each independently a substituted or unsubstituted C1 to C30 aliphatic hydrocarbon group, a substituted or unsubstituted C6 to C30 aromatic hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group having a hetero atom;
- R5, R6, and R7 are each independently hydrogen, a substituted or unsubstituted C1 to C30 aliphatic hydrocarbon group, a substituted or unsubstituted C6 to C30 aromatic hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group having a hetero atom;
- and
- M is an alkali metal.
2 more elements
Dependencies are inferred from the claim text.