# US 9,883,616 B2 · Manifold heat exchanger > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,883,616 B2 - Document ID: US9883616B2 - Status: Granted - Kind: B2 - Application number: 14/500,970 - Filed: 2014-09-29 - Published: 2016-03-31 - Granted: 2018-01-30 - Earliest claimed: 2014-09-29 - Assignees: International Business Machines Corporation - Applicants: International Business Machines Corporation - Inventors: Timothy J. Chainer; Pritish R. Parida - Web page: https://patentgrep.com/patent/US9883616B2 ## CPC - H05K 7/20781: {within cabinets for removing heat from server blades} - F28F 9/02: Header boxes; End plates - H05K 7/20272: {Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds} - H05K 7/20772: {within server blades for removing heat from heat source} - F28D 9/0031: {the conduits for one heat-exchange medium being formed by paired plates touching each other (F28D9/0012, F28D9/0025, F28D9/0081, F28D9/04 take precedence)} - F28F 9/26: Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators (connecting different sections in water heaters F24H9/14 {, connecting headers with inlet or outlet fittings F28F9/0246}) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) ## Abstract A manifold for cooling electronic equipment, the manifold including a facility side coolant supply line, a facility side coolant return line, liquid-to-liquid heat exchangers, and pumps. The liquid-to-liquid heat exchangers are connected in parallel to the facility side coolant supply line. Each of the pumps is coupled to a liquid-to-liquid heat exchanger and regulates coolant flow through the coupled liquid-to-liquid heat exchangers. ## Claims ### Claim 1 A manifold for cooling electronic equipment, the apparatus manifold comprising: a facility side coolant supply line; a facility side coolant return line coupled to the manifold; a plurality of liquid-to-liquid heat exchangers connected in parallel to the facility side coolant supply line; and a plurality of pumps fastened to the manifold, each of the pumps is coupled to at least one of the liquid-to-liquid heat exchangers and regulates coolant flow through at least one of the liquid-to-liquid heat exchangers; a plurality of valves, the valves are coupled to the facility side coolant supply line, each of the valves controls the coolant flow from the facility side coolant supply line to a respective liquid-to-liquid heat exchanger; and a plurality of bypass lines, each of the valves regulates the coolant flow from the facility side coolant supply line between the respective liquid-to-liquid heat exchanger and a respective bypass line of the plurality of bypass lines. ### Claim 2 (depends on 1) The manifold of claim 1, wherein the liquid-to-liquid heat exchangers are connected in parallel to the facility side coolant return line. ### Claim 3 (depends on 1) The manifold of claim 1, wherein each of the pumps is coupled to a respective liquid-to-liquid heat exchanger and regulates the coolant flow through the respective liquid-to-liquid heat exchanger. ### Claim 4 (depends on 1) The manifold of claim 1, further comprising a plurality of pressure sensors, each of the pressure sensors are connected to a respective liquid-to liquid-heat exchanger. ### Claim 5 (depends on 4) The manifold of claim 4, further comprising mounting hardware for attaching the manifold to a server rack. ### Claim 6 An apparatus for cooling electronic equipment comprising: a server rack to house a plurality of servers; and a manifold housed within the server rack, the manifold comprising: a facility side coolant supply line; a facility side coolant return line; a plurality of liquid-to-liquid heat exchangers connected in parallel to the facility side coolant supply line; a plurality of pumps fastened to the manifold, each of the pumps is coupled to at least one of the liquid-to-liquid heat exchangers and at least one of the servers, and wherein each of the pumps regulates coolant flow through at least one of the liquid-to-liquid heat exchangers and at least one of the servers; a plurality of valves, the valves are coupled to the facility side coolant supply line, each of the valves controls the coolant flow from the facility side coolant supply line to a respective liquid-to-liquid heat exchanger; and a plurality of bypass lines, each of the valves regulates the coolant flow from the facility side coolant supply line between the respective liquid-to-liquid heat exchanger and a respective bypass line of the plurality of bypass lines. ### Claim 7 (depends on 6) The apparatus of claim 6, wherein the pumps, the respective liquid-to-liquid heat exchangers, and the respective servers form a plurality of discrete coolant flow loops. ### Claim 8 (depends on 6) The apparatus of claim 6, wherein each of the pumps is coupled to the respective liquid-to-liquid heat exchanger and regulates the coolant flow through the liquid-to-liquid heat exchanger. ### Claim 9 (depends on 6) The apparatus of claim 6, wherein the manifold further comprises leak detectors to detect coolant leakage in the server rack. ### Claim 10 A method of liquid cooling using a manifold: detecting that a server on a server rack is connected to the manifold; enabling liquid coolant to flow through a liquid-to-liquid heat exchanger connected to the server upon detecting that the server is connected to the manifold, wherein the liquid-to-liquid heat exchanger is one of a plurality of liquid-to-liquid heat exchangers connected in parallel at the manifold to a facility side coolant supply line; and activating a pump physically coupled to the liquid-to-liquid heat exchanger upon detecting that the server is connected to the manifold, the pump regulates coolant flow from the liquid-to-liquid heat exchanger to the server; detecting that the server on the server rack is disconnected from the manifold; identifying the liquid-to-liquid heat exchanger that has been disconnected from the server; and disabling coolant flow to the liquid-to-liquid heat exchanger that has been disconnected from the server by activating a valve diverting coolant flow from the liquid-to-liquid heat exchanger that has been disconnected from the server to one of a plurality of bypass lines within the manifold. ### Claim 11 (depends on 10) The method of claim 10, wherein enabling the liquid coolant to flow through the liquid-to-liquid heat exchanger includes manipulating a valve coupled to the facility side coolant supply line to allow the coolant flow from the facility side coolant supply line to the liquid-to-liquid heat exchanger. ### Claim 12 (depends on 10) The method of claim 10, further comprising enabling a coolant leak detection system for the server upon detecting that the server is connected to the manifold. ### Claim 13 (depends on 10) The method of claim 10, further comprising: deactivating the pump coupled to the liquid-to-liquid heat exchanger upon identifying the liquid-to-liquid heat exchanger.