# US 9,883,598 B2 · Circuit board and method for manufacturing the same

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- Number: US 9,883,598 B2
- Document ID: US9883598B2
- Status: Granted
- Kind: B2
- Application number: 15/289,950
- Filed: 2016-10-10
- Published: 2017-02-02
- Granted: 2018-01-30
- Earliest claimed: 2015-04-24
- Assignees: Unimicron Technology Corp.
- Applicants: Unimicron Technology Corp.
- Inventors: Yin-Ju Chen; Ming-Hao Wu; Cheng-Po Yu
- Web page: https://patentgrep.com/patent/US9883598B2

## CPC

- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- G06F 1/206: {comprising thermal management}
- H05K 1/0206: {by printed thermal vias}
- H05K 1/113: {Via provided in pad; Pad over filled via}
- H05K 1/181: associated with surface mounted components
- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H05K 1/187: {the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier}
- H05K 3/4647: {by applying an insulating layer around previously made via studs}
- H05K 3/4697: {having cavities, e.g. for mounting components (H05K3/4691 takes precedence)}
- H10N 10/13: characterised by the heat-exchanging means at the junction
- H10W 40/735: {by melting or evaporation of solids}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/635: {Through-vias}
- H10W 70/68: Shapes or dispositions thereof
- H05K 2201/048: Second PCB mounted on first PCB by inserting in window or holes of the first PCB
- H05K 2201/10219: Thermoelectric component
- H05K 2201/10378: Interposers
- H05K 2201/10515: Stacked components
- H05K 2201/10734: Ball grid array [BGA]; Bump grid array
- H10W 70/682: {comprising holes having chips therein}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

## Claims

### Claim 1

A method for a circuit board having a heat-recovery function, comprising:
forming at least one first via at a single-layer dielectric layer and disposing at least one first heat-conducting pillar in the first via;
building up a plurality of buildup-dielectric layers from the single-layer dielectric layer to form a substrate;
respectively forming a first recess and a second recess on two opposite surfaces of the substrate, wherein the single-layer dielectric layer is between the first recess and the second recess;
disposing a thermoelectric device into the first recess for embedding the thermoelectric device in the substrate, wherein the thermoelectric device is connected to the first heat-conducting pillar;
forming at least one second via at a heat-storing device and filling the second via with at least one second heat-conducting pillar such that the heat-storing device is penetrated by the second heat-conducting pillar;
disposing a processor on the heat-storing device, wherein the processor is connected to and in contact with the second heat-conducting pillar; and
disposing the heat-storing device and the processor into the second recess for embedding the heat-storing device in the substrate, wherein the heat-storing device is between the processor and the thermoelectric device.

### Claim 2 (depends on 1)

The method of claim 1, wherein the disposing the processor on the heat-storing device comprises:
disposing the processor in a third recess of the heat-storing device.

### Claim 3 (depends on 1)

The method of claim 1, wherein the first heat-conducting pillar is coupled to the second heat-conducting pillar through a solder ball after the disposing the heat-storing device and the processor into the second recess.

### Claim 4 (depends on 1)

The method of claim 1, wherein the first heat-conducting pillar and the second heat-conducting pillar are aligned to a line.