# US 9,883,589 B2 · Wiring board, and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,883,589 B2 - Document ID: US9883589B2 - Status: Granted - Kind: B2 - Application number: 14/764,795 - Filed: 2014-07-30 - Published: 2015-12-24 - Granted: 2018-01-30 - Earliest claimed: 2013-07-30 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Kouichi Kawasaki - Web page: https://patentgrep.com/patent/US9883589B2 ## CPC - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings} - H05K 1/181: associated with surface mounted components - H05K 3/3431: {Leadless components} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/68: Shapes or dispositions thereof - H10W 72/30: Die-attach connectors - H10W 76/47: Solid or gel fillings - H05K 3/243: {characterised by selective plating, e.g. for finish plating of pads (selective plating for making the circuit pattern H05K3/108, H05K3/182)} - H05K 3/244: {Finish plating of conductors, especially of copper conductors, e.g. for pads or lands (selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3465)} - H05K 3/4629: {laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets} - H05K 2201/09154: Bevelled, chamferred or tapered edge - H05K 2201/09163: Slotted edge - H05K 2201/09381: Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component - H05K 2201/094: Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads - H05K 2201/09418: Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation - H05K 2201/09663: Divided layout, i.e. conductors divided in two or more parts - H05K 2201/097: Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components - H05K 2201/098: Special shape of the cross-section of conductors, e.g. very thick plated conductors - H05K 2201/10068: Non-printed resonator - H05K 2201/10075: Non-printed oscillator - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/10151: Sensor - H05K 2201/2054: Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics - H05K 2203/1178: Means for venting or for letting gases escape - H10W 72/884: {Die-attach connectors and bond wires} - H10W 72/931: {Shapes of bond pads} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/753: {between laterally-adjacent chips} - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A wiring board has an insulation base plate, and a plurality of electrodes provided adjacent to each other in plan view on the insulation base plate, the electrodes have an opening in the outer periphery and a slit oriented from the outer periphery to the interior, and, among two electrodes adjacent to each other, the slit in one electrode has a central line intersecting the outer periphery of the other electrode. ## Claims ### Claim 1 A wiring board, comprising: an insulation base plate; and a plurality of electrodes provided adjacent to each other on the insulation base plate; the electrodes each comprising a respective slit that includes an opening on an outer peripheral edge of the electrode and is oriented towards an interior portion of the electrode, wherein a first central line drawn from a first slit in a first electrode of a pair of adjacent electrodes intersects with the outer peripheral edge of a second electrode of the pair, a second central line drawn from a second slit in the second electrode in with the outer peripheral edge of the first electrode, and the first central line and the second central line irrtersect with each other, and wherein a gap between the first electrode and the second electrode is greater at an electrode top surface side than at an insulation base plate side of the first electrode and the second electrode. ### Claim 2 (depends on 1) The wiring board according to claim 1, wherein the first slit comprises the opening at a first end, and is closed at a second end. ### Claim 3 (depends on 2) The wiring board according to claim 2, wherein the first slit extends towards a center of the first electrode. ### Claim 4 (depends on 3) The wiring board according to claim 3, wherein the first electrode has a rectangular shape, and the first end of the first slit is in a corner of the first electrode. ### Claim 5 (depends on 3) The wiring board according to claim 3, wherein the second end of the first slit is situated in a central portion of the first electrode. ### Claim 6 (depends on 2) The wiring board according to claim 2, wherein a width of the first slit at the opening is greater than the width of the first slit at the second end. ### Claim 7 (depends on 6) The wiring board according to claim 6, wherein the width of the first slit gradually increases from the second end of the first slit towards the opening of the firs slit. ### Claim 8 (depends on 1) The wiring board according to claim 1, wherein the first electrode comprises a plurality of slits, each slit in the plurality starting at a periphery of the first electrode and extending towards an interior portion of the first electrode. ### Claim 9 (depends on 1) The wiring board according to claim 1, wherein a width of the first slit is greater at the electrode top surface side than at the insulation base plate side. ### Claim 10 (depends on 1) An electronic device, comprising: the wiring board described in claim 1; and a plurality of electronic components mounted on each of the electrodes of the wiring board. ### Claim 11 (depends on 10) The electronic device according to claim 10, wherein the first slit overlaps with at least one of the electronic components.