# US 9,883,588 B2 · Oriented copper plate, copper-clad laminate, flexible circuit board, and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,883,588 B2 - Document ID: US9883588B2 - Status: Granted - Kind: B2 - Application number: 15/533,195 - Filed: 2015-12-11 - Published: 2017-11-16 - Granted: 2018-01-30 - Earliest claimed: 2014-12-12 - Assignees: Nippon Steel & Sumitomo Metal Corporation - Applicants: Nippon Steel & Sumitomo Metal Corporation - Inventors: Keiichi Kimura; Tomohiro Uno; Kazuaki Kaneko - Web page: https://patentgrep.com/patent/US9883588B2 ## CPC - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - C22C 9/00: Alloys based on copper - C22F 1/08: of copper or alloys based thereon - H01B 1/02: mainly consisting of metals or alloys - H01B 1/026: {Alloys based on copper} - H01B 5/02: Single bars, rods, wires, or strips - H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)} - H05K 1/05: Insulated {conductive substrates, e.g. insulated} metal substrate - H05K 3/022: {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates} - H05K 3/06: the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} - H05K 3/38: Improvement of the adhesion between the insulating substrate and the metal - C22F 1/00: Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working (apparatus for mechanical working of metal B21, B23, B24) - H05K 2201/0154: Polyimide - H05K 2201/0317: Thin film conductor layer; Thin film passive component - H05K 2201/0355: Metal foils - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C22C: ALLOYS (treatment of alloys C21D, C22F) - C22F: CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS (surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by this subclass, C23F17/00) - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) ## Abstract According to this invention, an oriented copper plate which has a highly developed cube texture and has strength and breaking elongation greater than those of a conventional material having a cube texture, a copper-clad laminate, a flexible circuit board that is excellent in terms of folding flexibility, and an electronic device are provided, and a process for producing the oriented copper plate is established. This invention relates: an oriented copper plate, which contains 0.03% by mass to 1.0% by mass of Cr, the remainder of which is composed of copper and inevitable impurities, wherein the copper plate has a <100> main orientation so that the area percentage of a <100> preferred orientation region is not less than 60.0%, the region satisfying a condition that allows each of a thickness direction of the copper plate and a specific in-plane direction of the copper plate to have an orientation difference of not more than 15° with respect to a <100> basic copper crystal axis of unit lattice of copper, and wherein Cr precipitates having equivalent circle diameters of 4 nm to 52 nm are present at 300 precipitates/μm3 to 12000 precipitates/μm3; a copper-clad laminate and a flexible circuit board using the copper plate; and an electronic devices equipped with the flexible circuit board. ## Claims ### Claim 1 An oriented copper plate, which contains 0.03% by mass to 1.0% by mass of Cr, the remainder of which is composed of copper and inevitable impurities, wherein the copper plate has a <100> main orientation so that the area percentage of a <100> preferred orientation region is not less than 60.0%, the region satisfying a condition that allows each of a thickness direction of the copper plate and a specific in-plane direction of the copper plate to have an orientation difference of not more than 15° with respect to a <100> copper crystal axis, and wherein Cr precipitates having equivalent circle diameters of 4 nm to 52 nm are present at 300 precipitates/μm3 to 12000 precipitates/μm3. ### Claim 2 (depends on 1) The oriented copper plate according to claim 1, which further contains one or two or more of: Mn: not more than 0.4% by mass; Al: not more than 0.4% by mass; Ti: not more than 0.2% by mass; Zr: not more than 0.2% by mass; and rare earth elements: not more than 0.4% by mass. ### Claim 3 (depends on 1) The oriented copper plate according to claim 1, which further contains one or two of: P: less than 0.01% by mass; and Zn: less than 0.1% by mass. ### Claim 4 (depends on 1) The oriented copper plate according to claim 1, which further contains, at a total concentration of less than 0.03% by mass, one or two or more selected from the group consisting of: Ag, Sn, Pd, Ni, Fe, B, Si, Ca, V, Co, Ga, Ge, Sr, Nb, Mo, Rh, Ba, W, and Pt. ### Claim 5 (depends on 1) A copper-clad laminate, which has an insulating layer formed on a surface of the oriented copper plate according to claim 1. ### Claim 6 (depends on 5) The copper-clad laminate according to claim 5, wherein the oriented copper plate has a thickness of 5 μm to 18 μm, and the insulating layer is composed of a resin and has a thickness of 5 μm to 75 μm. ### Claim 7 (depends on 6) The copper-clad laminate according to claim 6, wherein the resin is composed of polyimide. ### Claim 8 (depends on 5) A flexible circuit board, which has a certain wiring formed on the oriented copper plate of the copper-clad laminate according to claim 5, which further has a bending portion at least one site of the wiring in a direction orthogonal to a specific in-plane direction of the copper plate. ### Claim 9 (depends on 8) The flexible circuit board according to claim 8, wherein the bending portion is a bending portion which conducts one or two or more repetitive actions selected from the group consisting of lock seaming bending, rotary slide bending, folding bending, hinge bending, and lateral slide bending. ### Claim 10 (depends on 8) An electronic device, which is equipped with the flexible circuit board according to claim 8.