# US 9,883,168 B2 · Camera module having an array sensor

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- Number: US 9,883,168 B2
- Document ID: US9883168B2
- Status: Granted
- Kind: B2
- Application number: 14/961,510
- Filed: 2015-12-07
- Published: 2016-04-21
- Granted: 2018-01-30
- Earliest claimed: 2012-09-19
- Assignees: LG Innotek Co., Ltd.
- Applicants: LG Innotek Co., Ltd.
- Inventors: Min Soo Kim
- Web page: https://patentgrep.com/patent/US9883168B2

## CPC

- H04N 13/243: using three or more two-dimensional [2D] image sensors
- H04N 13/239: using two two-dimensional [2D] image sensors having a relative position equal to or related to the interocular distance (H04N13/243 takes precedence)
- H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
- H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof
- H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An exemplary embodiment of the present disclosure includes an array sensor arrayed with a plurality of image sensors, and a plurality of lens units respectively mounted on the plurality of image sensors.

## Claims

### Claim 1

A camera module, the camera module comprising:
an array sensor comprising a plurality of image sensors disposed on a first surface thereof and a ground line disposed on the first surface thereof;
a plurality of lens units disposed on the array sensor; and
a shield member comprising an upper plate having a plurality of windows formed at a position corresponding with that of the plurality of lens units, and a lateral plate extended from the upper plate to cover the lens units, the shield member being electrically connected with the ground line,
wherein the ground line is spaced apart from the plurality of image sensors and an outer periphery of the array sensor.

### Claim 2 (depends on 1)

The camera module of claim 1, further comprising a blocking member connected between each of the lens unit and the shield member, the blocking member being configured to block spill light, and the blocking member being disposed along an inner periphery of each window of the shield member.

### Claim 3 (depends on 2)

The camera module of claim 2 wherein the blocking member is disposed along an outer periphery of an upper surface of the corresponding lens unit.

### Claim 4 (depends on 2)

The camera module of claim 2, wherein the blocking member includes epoxy.

### Claim 5 (depends on 1)

The camera module of claim 1, further comprising a PCB (Printed Circuit Board) electrically connected to the array sensor.

### Claim 6 (depends on 5)

The camera module of claim 5, further comprising a solder ball disposed on a bottom surface of the array sensor, the solder ball electrically connecting the array sensor to the PCB.

### Claim 7 (depends on 5)

The camera module of claim 5, wherein the PCB is formed with a cavity, and
wherein a portion of the array sensor is disposed within the cavity of the PCB, and coupled to a bottom surface of the PCB.

### Claim 8 (depends on 7)

The camera module of claim 7, wherein the PCB includes a plurality of through holes, and
wherein the lens units are respectively disposed on upper surfaces of the image sensors through the through holes.

### Claim 9 (depends on 1)

The camera module of claim 1, wherein the image sensors are disposed in one imaginary plane.

### Claim 10 (depends on 1)

The camera module of claim 1, wherein the shield member is in contact with the ground line.

### Claim 11 (depends on 1)

The camera module of claim 1, further comprising connection units extending between adjacent lens units of the plurality of lens units, the connection units being integrally formed with the adjacent lens units.

### Claim 12 (depends on 1)

The camera module of claim 1, wherein the shield member includes a partition extending from the upper plate of the shield member, the partition being disposed at an array sensor area between the lens units in order to isolate each of the lens units.

### Claim 13 (depends on 1)

The camera module of claim 1, wherein the lens units are directly mounted on respective image sensors.

### Claim 14 (depends on 1)

A smart phone comprising the camera module of claim 1.

### Claim 15

A camera module, the camera module comprising:
an array sensor comprising a plurality of image sensors disposed on a first surface thereof and a ground line disposed on the first surface thereof;
a plurality of lens units disposed on the array sensor;
a shield member comprising an upper plate having a plurality of windows formed at a position corresponding with that of the plurality of lens units, and a lateral plate extended from the upper plate to cover the lens units, the shield member being electrically connected with the ground line; and
a blocking member connected between each of the lens units and the shield member to block spill light,
wherein the ground line is spaced apart from the plurality of image sensors and an outer periphery of the array sensor.