# US 9,883,166 B2 · Three dimensional image pick-up device and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,883,166 B2 - Document ID: US9883166B2 - Status: Granted - Kind: B2 - Application number: 14/611,375 - Filed: 2015-02-02 - Published: 2015-05-28 - Granted: 2018-01-30 - Earliest claimed: 2010-10-08 - Assignees: LG Innotek Co., Ltd. - Applicants: LG Innotek Co., Ltd. - Inventors: Sangyun Oh; Seongcheol Jeong - Web page: https://patentgrep.com/patent/US9883166B2 ## CPC - H04N 13/239: using two two-dimensional [2D] image sensors having a relative position equal to or related to the interocular distance (H04N13/243 takes precedence) - B29D 11/00807: {Producing lenses combined with electronics, e.g. chips} - G03B 35/08: by simultaneous recording - H04N 23/50: Constructional details - B29C 65/18: using heated tools - B29C 65/48: using adhesives {, i.e. using supplementary joining material; solvent bonding} - B29C 65/483: {Reactive adhesives, e.g. chemically curing adhesives} - B29C 66/1122: {Single lap to lap joints, i.e. overlap joints (B29C66/45, B29C66/472, B29C66/52272 take precedence)} - B29C 66/54: {Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles} - B29C 66/73775: {the to-be-joined area of at least one of the parts to be joined being crystalline} - B29C 66/7394: {characterised by the material of at least one of the parts being a thermoset} - B29C 66/81431: {comprising a single cavity, e.g. a groove} - B29C 66/8322: {Joining or pressing tools reciprocating along one axis} - B29L 2031/3425: {Printed circuits} - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - B29D: PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE (making granules B29B9/00; making preforms B29B11/00) - G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D) - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES ## Abstract A 3-D image pick-up device is disclosed, the device including: a PCB mounted with two camera modules including an image sensor; and a reinforcing member mounted with two exposure windows, wherein the PCB and the reinforcing member are mutually adhered to allow the camera modules of the PCB to be exposed through the exposure window of the reinforcing member. ## Claims ### Claim 1 A 3-D image pick-up device, comprising: a PCB (Printed Circuit Board); two camera modules, the two camera modules disposed on an upper surface of the PCB; a reinforcing member comprising two exposure windows disposed at positions corresponding with that of the two camera modules, the reinforcing member coupled to the upper surface of the PCB; and at least one rib disposed on the reinforcing member and spaced apart from the two exposure windows, wherein the two camera modules comprise a first camera module and a second camera module spaced apart from each other, wherein the reinforcing member is configured to prevent the PCB from being bent, wherein a distance from the upper surface of the PCB to an upper surface of each of the two camera modules is longer than a distance from the upper surface of the PCB to an upper surface of the reinforcing member so that a first portion of a lateral surface of the first camera module is exposed outside the reinforcing member, and a second portion of a lateral surface of the second camera module is exposed outside the reinforcing member, wherein the first portion of the first camera module is parallel with the second portion of the second camera module, and wherein the first portion of the first camera module faces the second portion of the second camera module. ### Claim 2 (depends on 1) The 3-D image pick-up device of claim 1, wherein a lens housing center axis of each camera module is arranged to the front through the corresponding exposure window of the reinforcing member. ### Claim 3 (depends on 1) The 3-D image pick-up device of claim 1, wherein the reinforcing member and the PCB are adhered by a thermosetting epoxy coated on the mutually contacted surface. ### Claim 4 (depends on 1) The 3-D image pick-up device of claim 1, wherein the rib is a groove or a hole. ### Claim 5 (depends on 1) The 3-D image pick-up device of claim 1, wherein material of the reinforcing member is thermosetting crystalline polymer. ### Claim 6 (depends on 1) The 3-D image pick-up device of claim 1, wherein an adhesive is interposed between the exposure windows of the reinforcing member and the two camera modules. ### Claim 7 (depends on 1) The 3-D image pick-up device of claim 1, wherein the PCB is formed with at least one lug, and the reinforcing member is formed with a hole for inserting the lug. ### Claim 8 (depends on 7) The 3-D image pick-up device of claim 7, wherein the hole is formed adjacent to the exposure windows of the reinforcing member. ### Claim 9 (depends on 1) The 3-D image pick-up device of claim 1, wherein the first portion of the first camera module has an area corresponding with that of the second portion of the second camera module. ### Claim 10 A 3-D image pick-up device, comprising: a PCB (Printed Circuit Board); two camera modules, the two camera modules discretely disposed on an upper surface of the PCB; a reinforcing member comprising two exposure windows correspondingly formed at positions of the two camera modules, the reinforcing member coupled to the upper surface of the PCB; at least one rib formed between the two exposure windows; and a connector unit disposed on the upper surface of the PCB, wherein the two camera modules comprises a first camera module and a second camera module spaced apart from each other, wherein the reinforcing member further comprises an opening disposed at a portion corresponding to a position of the connector unit disposed on the PCB, wherein a distance from the upper surface of the PCB to an upper surface of each of the two camera modules is longer than a distance from the upper surface of the PCB to an upper surface of the reinforcing member so that a first portion of a lateral surface of the first camera module is exposed outside the reinforcing member and a second portion of a lateral surface of the second camera module is exposed outside the reinforcing member, wherein the first portion of the first camera module is parallel with the second portion of the second camera module, and wherein the first portion of the first camera module faces the second portion of the second camera module. ### Claim 11 (depends on 10) The 3-D image pick-up device of claim 10, further comprising a rib formed between the two camera modules and the connector unit. ### Claim 12 (depends on 11) The 3-D image pick-up device of claim 11, wherein the rib is formed at a remaining area except for the exposure window and the opening. ### Claim 13 A method for manufacturing a 3-D image pick-up device, the method comprising: attaching two camera modules, each camera module including an image sensor, to a PCB (Printed Circuit Board); coating a thermosetting epoxy on a predetermined surface of the PCB; temporarily coupling a reinforcing member formed with an exposure window to the PCB coated with the thermosetting epoxy; arranging the reinforcing member temporarily coupled PCB to a hot plate, the reinforcing member including two exposure windows correspondingly formed at positions of the two camera modules and at least one rib formed between the two exposure windows, and the reinforcing member being coupled to an upper surface of the PCB to prevent the PCB from being bent; and pressing an upper surface of the reinforcing member for coupling the reinforcing member by curing the thermosetting epoxy, wherein the two camera modules are discretely formed and a connector unit is mounted at an area of the PCB, wherein the reinforcing member is formed with an opening at a portion corresponding to a position of the connector unit mounted at the PCB, and wherein a distance from the upper surface of the PCB to an upper surface of each of the two camera modules is longer than a distance from the upper surface of the PCB to an upper surface of the reinforcing member so that a portion of a lateral surface of each of the two camera modules is exposed outside the reinforcing member. ### Claim 14 (depends on 13) The method of claim 13, wherein the pressing the upper surface of the reinforcing member for coupling the reinforcing member by curing the thermosetting epoxy includes pressing by using a curing jig formed with a concave portion at a portion of the exposure window. ### Claim 15 (depends on 13) The method of claim 13, wherein a lens housing center axis of each camera module is arranged to the front through the corresponding exposure window of the reinforcing member. ### Claim 16 (depends on 13) The method of claim 13, wherein a rib is formed between the two camera modules and the connector unit. ### Claim 17 (depends on 16) The method of claim 16, wherein the rib is formed at a remaining area except for the exposure window and the opening window. ### Claim 18 (depends on 13) The method of claim 13, wherein material of the reinforcing member is thermosetting crystalline polymer. ### Claim 19 (depends on 13) The method of claim 13, wherein the two camera modules comprise a first camera module and a second camera module spaced apart from each other, wherein a first portion of a lateral surface of the first camera module is exposed outside the reinforcing member and a second portion of a lateral surface of the second camera module is exposed outside the reinforcing member, wherein the first portion of the first camera module is parallel with the second portion of the second camera module, and wherein the first portion of the first camera module faces the second portion of the second camera module.