# US 9,882,646 B2 · System and method for reduced power consumption and heat removal in optical and optoelectronic devices and subassemblies

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- Number: US 9,882,646 B2
- Document ID: US9882646B2
- Status: Granted
- Kind: B2
- Application number: 15/164,313
- Filed: 2016-05-25
- Published: 2016-09-15
- Granted: 2018-01-30
- Earliest claimed: 2012-04-19
- Assignees: Oe Solutions America, Inc.
- Applicants: OE Solutions America, Inc.
- Inventors: Daniel Jacob Blumenthal
- Web page: https://patentgrep.com/patent/US9882646B2

## CPC

- H04B 10/40: Transceivers
- G02B 6/4271: {with thermo electric cooling}
- H01S 3/0405: {Conductive cooling, e.g. by heat sinks or thermo-electric elements}
- H01S 5/02469: {Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC}
- H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps}
- H01S 3/0401: {of optical elements being part of laser resonator, e.g. windows, mirrors, lenses}
- H01S 5/02251: using optical fibres
- H01S 5/02407: {Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling}
- H01S 5/02415: {by using a thermo-electric cooler [TEC], e.g. Peltier element}
- H01S 5/02438: {Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens}
- H04B 10/503: {Laser transmitters}
- H04B: TRANSMISSION
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A heat removal system for use in optical and optoelectronic devices and subassemblies is provided. The heat removal system lowers the power consumption of one or more active cooling components within the device or subassembly, such as a TEC, which is used to remove heat from heat generating components within the device or subassembly. For any particular application, the heat removal system more efficiently removes the heat from the active cooling component, by using a heat transfer assembly, such as a planar heat pipe type assembly. The heat transfer assembly employs properties like, but not limited to, phase transition change and thermal conductivity to move heat without external power. In some embodiments, the heat transfer assembly can be used to allow the active cooling component, such as a TEC to be removed, leaving the heat transfer assembly to remove the heat from the device or subassembly.

## Claims

### Claim 1

An optical communications apparatus, the optical communications apparatus comprising:
a transmitter optical subassembly;
a receiver optical subassembly;
a housing for enclosing the transmitter optical subassembly and the receiver optical subassembly;
an active cooling component for removing heat from at least one of one or more heat generating components, the active cooling component including a first direct thermal connection and a direct mechanical connection with the at least one of one or more heat generating components; and
a heat transfer assembly having a second direct thermal connection with the active cooling component, the second direct thermal connection comprising a conductive platform,
wherein the heat transfer assembly provides a mechanical supporting structure for one or more of the heat generating components.

### Claim 2 (depends on 1)

The optical communications apparatus of claim 1, wherein the heat transfer assembly includes a substantially planar two dimensional vessel which combines both thermal conductivity and phase transition, and wherein the conductive platform serves as a base of the housing.

### Claim 3 (depends on 1)

The optical communications apparatus of claim 1, wherein the one or more heat generating components comprise a laser, a laser transmitter, or a non-heat generating element that requires temperature stabilization.

### Claim 4 (depends on 1)

The optical communications apparatus of claim 1, wherein the one or more heat generating components comprise a photonic integrated circuit, or an optoelectronic circuit, and the active cooling component is in thermal connectivity with the photonic integrated circuit or the optoelectronic circuit, and the heat transfer assembly is in thermal connection with the active cooling component.

### Claim 5 (depends on 1)

The optical communications apparatus of claim 1, wherein the conductive platform is disposed between the heat transfer assembly and the active cooling component, and the heat transfer assembly is exposed at least in part external to the housing.

### Claim 6 (depends on 1)

The optical communications apparatus of claim 1, wherein the heat transfer assembly extends substantially along a width of the housing and a length of the heat transfer assembly is exposed at least in part externally to the housing.

### Claim 7 (depends on 1)

The optical communications apparatus of claim 1, wherein the heat transfer assembly is less than 1 mm in height, and extends substantially over an area of the active cooling component.

### Claim 8 (depends on 1)

The optical communications apparatus of claim 1, wherein the heat transfer assembly is a substantially planar heat pipe type assembly comprising a two-dimensional vessel having interior nano-structures or micro-structures.

### Claim 9 (depends on 1)

The optical communications apparatus of claim 1, wherein the one or more heat generating components and active cooling components are configured to stack vertically on a top of the heat transfer assembly.

### Claim 10 (depends on 1)

The optical communications apparatus of claim 1, wherein the heat transfer assembly is in direct thermal connection and direct mechanical connection with an active heat removal element.

### Claim 11 (depends on 1)

The optical communications apparatus of claim 1, wherein the heat transfer assembly is in direct thermal connection and direct mechanical connection with the active cooling component, and the active cooling component is in direct thermal connection and direct mechanical connection with the at least one of the one or more heat generating components.

### Claim 12 (depends on 1)

The optical communications apparatus of claim 1, wherein the optical communications apparatus further comprises a heat dissipating apparatus in thermal connection with the heat transfer assembly.