# US 9,882,556 B2 · Integrated magnetic field sensor-controlled switch devices

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- Number: US 9,882,556 B2
- Document ID: US9882556B2
- Status: Granted
- Kind: B2
- Application number: 14/884,966
- Filed: 2015-10-16
- Published: 2016-03-24
- Granted: 2018-01-30
- Earliest claimed: 2011-10-06
- Assignees: Infineon Technologies AG
- Applicants: Infineon Technologies AG
- Inventors: Sebastian Maerz; Jean-Marie Le Gall; Udo Ausserlechner
- Web page: https://patentgrep.com/patent/US9882556B2

## CPC

- H03K 17/0822: {in field-effect transistor switches}
- H03K 17/90: by the use, as active elements, of galvano-magnetic devices, e.g. Hall-effect devices (H03K17/95, H03K17/97 take precedence)
- H03K 17/9517: {using galvanomagnetic devices}
- H10W 90/00: Package configurations
- H03K 2017/0806: {against excessive temperature}
- H03K 2217/0063: High side switches, i.e. the higher potential [DC] or life wire [AC] being directly connected to the switch and not via the load
- Y10T 29/49117: Conductor or circuit manufacturing
- H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Embodiments relate to integrated magnetic field sensor-controlled switch devices, such as transistors, current sources, and power switches, among others. In an embodiment, a magnetic switch and a load switch are integrated in a single integrated circuit device. In embodiments, the device can also include integrated load protection and load diagnostics. Embodiments can provide load switching and optional simultaneous logic signaling, for example to update a microcontroller or electronic control unit (ECU), while reducing space and complexity and thereby cost.

## Claims

### Claim 1

An integrated circuit comprising:
magnetic switch circuitry comprising a magnetic field sensor element;
load switching circuitry coupled to the magnetic switching circuitry; and
an integrated circuit package housing the magnetic switching circuitry and the load switching circuitry and comprising an output to couple the integrated circuit package to an external load to be controlled by the load switching circuitry switching the external load,
wherein the magnetic field switching circuitry is configured to send a logic signal and a load-control signal in parallel by sending the logic signal in a first connection to a microcontroller and sending the load-control signal in a different second connection to the load switching circuitry in response to a change in a magnetic field.

### Claim 2 (depends on 1)

The integrated circuit of claim 1, further comprising a die, wherein the magnetic field switching circuitry and load switching circuitry are formed on the die.

### Claim 3 (depends on 1)

The integrated circuit of claim 1, further comprising a pull-up resistor housed in the package.

### Claim 4 (depends on 1)

The integrated circuit of claim 1, wherein the magnetic field sensor element comprises at least one of a Hall-effect sensor element, a differential sensor element, a magnetoresistive sensor element, a magnetodiode device, a magnetotransistor device or a magnetic field-sensitive MOSFET device.

### Claim 5

A magnetic field sensor-controlled device comprising: an integrated circuit package:
magnetic field switch circuitry arranged in the package; load switch circuitry arranged in the package and coupled to the magnetic field switch circuitry; and
a back bias magnetic material coupled to the package;
wherein the magnetic field switching circuitry is configured to send a logic signal and a load-control signal in parallel by sending the logic signal in a first connection to a microcontroller and sending the load-control signal in a different second connection to load switching circuitry in response to a change in a magnetic field.

### Claim 6 (depends on 5)

The magnetic field sensor-controlled device of claim 5, wherein the back bias magnetic material is coupled to the package within the package.

### Claim 7 (depends on 5)

The integrated circuit of claim 5, wherein the magnetic field switch circuitry comprises at least one of a Hall-effect sensor element, a differential sensor element, a magnetoresistive sensor element, a magnetodiode device, a magnetotransistor device or a magnetic field-sensitive MOSFET device.

### Claim 8 (depends on 1)

The integrated circuit of claim 1, further comprising additional load switching circuitry coupled to the magnetic switch circuitry and disposed in the integrated circuit package.

### Claim 9 (depends on 5)

The magnetic field sensor-controlled device of claim 5, further comprising additional load switch circuitry coupled to the magnetic field switch circuitry and disposed in the package.

### Claim 10 (depends on 1)

The integrated circuit of claim 1, further comprising a pull-up resistor coupled to the magnetic switch circuitry and the load switching circuitry, wherein the pull-up resistor is external to a die on which the magnetic switch circuitry resides and is external to a die on which the load switch circuitry resides, and wherein the pull-up resistor is disposed in the integrated circuit package within which the magnetic switch circuitry and the load switch circuitry reside.

### Claim 11 (depends on 1)

The integrated circuit of claim 1, wherein at least one of the magnetic switch circuitry or the load switch circuitry comprise a temperature sensing circuit configured to generate a temperature output signal indicative of a sensed temperature and a control circuit configured to deactivate the at least one of the magnetic switch circuitry and the load switch circuitry, respectively, if the sensed temperature as indicated by the temperature output signal exceeds a predetermined threshold.

### Claim 12 (depends on 1)

The integrated circuit of claim 1, wherein the load switch circuitry is coupled electrically in series with a current rail of the magnetic switch circuitry.

### Claim 13 (depends on 1)

The integrated circuit of claim 1, wherein a current rail of the Magnetic switch circuitry comprises a die pad for the load switch circuitry, wherein a die of the load switch circuitry is mounted onto the current rail of the magnetic switch circuitry.

### Claim 14 (depends on 1)

The integrated circuit of claim 1, further comprising at least one of integrated load protection circuitry or integrated load diagnostics disposed in the integrated circuit package.